Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet

Abstract

The invention provides an apparatus and a method for bonding a sheet, and an apparatus and a method for manufacturing the sheet, which can well achieve the formation, the stripping and the bonding of a bonding sheet even when a stripping sheet is thinned. The sheet bonding device (10) comprises a discharging unit (14) discharging raw material rolls (RS) formed by temporarily bonding a band sheet (WS) on a band-shaped stripping sheet (RL); a cutting unit (15) forming a cut port (CU) on the band sheet (WS) and further forming a bonding sheet (AS) on the inner side of the cut port (CU); and a stripping plate (18) making the bonding sheet (AS) stripped from an initial stripping area (discharging direction front Sa) to a lower stripping area (inner side area SB). The cutting unit (15) is arranged in a way to form a cut port deeper than the initial cut port (CU1) corresponding to the initial stripping area (Sa) and a lower cut port (CU2) corresponding to the lower stripping area (Sb).

Description

technical field [0001] The present invention relates to a sheet sticking device and a sticking method, a sheet manufacturing device and a manufacturing method, and more specifically, to a sheet sticking device and a sticking method capable of forming an adhesive sheet by forming an incision on a strip-shaped sheet, and a sheet manufacturing device and manufacturing method. method. Background technique [0002] Conventionally, a sheet sticking device for sticking an adhesive sheet on an adherend such as a semiconductor wafer (hereinafter sometimes referred to as "wafer") has been widely used, and a related sheet sticking device is disclosed in, for example, Patent Document 1. . The sheet sticking device of Patent Document 1 is equipped with: a sending unit, which sends out a raw material roll, and the raw material roll is formed by temporarily pasting a strip-shaped sheet on a release sheet; a cutting knife, which forms a closed-loop incision in the process of sending out th...

AI Technical Summary

Problems solved by technology

However, in this case, since the thickness of the release sheet RL at the position where the slit CU is formed becomes too thin, the adhesive sheet may be stuck poorly as follows. And the corresponding part of the release sheet will fall off from the raw material roll RS, or, when the adhesive sheet is peeled off with the release plate, the corresponding part of the release sheet will also be peeled off together with the adhesive sheet, and it will be in a state with the part of the release sheet The adhesive sheet is pasted on the adherend

Images