Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet

A sheet pasting device and adhesive sheet technology, applied in the sheet pasting device and pasting, as well as the sheet manufacturing device and manufacturing field, can solve problems such as poor pasting of the adhesive sheet, and achieve the effect of easy peeling and pasting

Active Publication Date: 2013-04-10
LINTEC CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, since the thickness of the release sheet RL at the position where the slit CU is formed becomes too thin, the adhesive sheet may be stuck poorly as follows. And the corresponding part of the release sheet will fall off from the raw material roll RS, or, when the adhesive sheet is peeled off with the release plate, the corresponding part of the release sheet will also be peeled off together with the adhesive sheet, and it will be in a state with the part of the release sheet The adhesive sheet is pasted on the adherend

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet
  • Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet
  • Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Embodiments of the present invention will be described below with reference to the drawings.

[0030] In addition, in this specification, unless otherwise specified, terms such as "left", "right", "upper" and "lower" figure 1 as the benchmark.

[0031] exist figure 13, the sheet sticking device 10 is configured to include: a table 11 that absorbs and supports the wafer WF and the ring frame RF as an adherend; Move up; Sending unit 14, can send out raw material roll RS, and raw material roll RS is made of strip-shaped sheet RL and the strip-shaped sheet WS temporarily pasted on one side of peeling sheet RL; A slit CU is formed on the strip-shaped sheet WS of the raw material roll RS sent out, an adhesive sheet AS is formed inside the slit CU, and a useless sheet US is formed outside the slit CU; the winding unit 16 can roll the useless sheet US The release plate 18 as a peeling unit folds back the release sheet RL, thereby peeling the adhesive sheet AS from the rele...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an apparatus and a method for bonding a sheet, and an apparatus and a method for manufacturing the sheet, which can well achieve the formation, the stripping and the bonding of a bonding sheet even when a stripping sheet is thinned. The sheet bonding device (10) comprises a discharging unit (14) discharging raw material rolls (RS) formed by temporarily bonding a band sheet (WS) on a band-shaped stripping sheet (RL); a cutting unit (15) forming a cut port (CU) on the band sheet (WS) and further forming a bonding sheet (AS) on the inner side of the cut port (CU); and a stripping plate (18) making the bonding sheet (AS) stripped from an initial stripping area (discharging direction front Sa) to a lower stripping area (inner side area SB). The cutting unit (15) is arranged in a way to form a cut port deeper than the initial cut port (CU1) corresponding to the initial stripping area (Sa) and a lower cut port (CU2) corresponding to the lower stripping area (Sb).

Description

technical field [0001] The present invention relates to a sheet sticking device and a sticking method, a sheet manufacturing device and a manufacturing method, and more specifically, to a sheet sticking device and a sticking method capable of forming an adhesive sheet by forming an incision on a strip-shaped sheet, and a sheet manufacturing device and manufacturing method. method. Background technique [0002] Conventionally, a sheet sticking device for sticking an adhesive sheet on an adherend such as a semiconductor wafer (hereinafter sometimes referred to as "wafer") has been widely used, and a related sheet sticking device is disclosed in, for example, Patent Document 1. . The sheet sticking device of Patent Document 1 is equipped with: a sending unit, which sends out a raw material roll, and the raw material roll is formed by temporarily pasting a strip-shaped sheet on a release sheet; a cutting knife, which forms a closed-loop incision in the process of sending out th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67132H01L21/6836
Inventor 石原崇
Owner LINTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com