Method for manufacturing semiconductor device

Abstract

In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and / or a laser process.

Description

technical field [0001] The present invention relates generally to a method, and more particularly to a method of separating semiconductor devices from a wafer carrier. Background technique [0002] Semiconductor devices are used in many electronic and other applications. Semiconductor devices may include integrated circuits formed on semiconductor wafers. Alternatively, semiconductor devices may be formed as monolithic devices, such as discrete devices. Semiconductor devices are formed on a semiconductor wafer by placing various material films on the semiconductor wafer, patterning the material films, doping selected regions of the semiconductor wafer, and the like. [0003] In traditional semiconductor manufacturing processes, a large number of semiconductor devices are fabricated on a single wafer. After the device-level and interconnect-level manufacturing processes are completed, the semiconductor devices on the wafer are separated. For example, wafers can be diced a...

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