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Silicone plastic package rectifier diode

A rectifier diode and diode technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of breakdown and damage of silicon plastic-encapsulated rectifier diodes, and achieve the effect of avoiding breakdown damage and simple structure.

Inactive Publication Date: 2013-04-10
孔明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When selecting silicon plastic-encapsulated rectifier diodes, parameters such as its maximum rectification current, maximum reverse operating current, cut-off frequency, and reverse recovery time should be considered. When, it will cause the silicon plastic rectifier diode breakdown damage

Method used

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  • Silicone plastic package rectifier diode
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Examples

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Embodiment Construction

[0012] The present invention will now be further described in conjunction with specific examples, and the following examples are intended to illustrate the present invention rather than further limit the present invention.

[0013] Such as Figure 1~2 The shown silicon plastic rectifier diode includes a diode body 1, and the diode body 1 includes a PN junction 2, a positive terminal 3 and a negative terminal 4, and the PN junction 2, the positive terminal 3 and the negative terminal 4 are located on the same silicon substrate 5 On the top, the positive terminal 3 and the negative terminal 4 are distributed at both ends of the silicon substrate 5, and the positive terminal 3 and the negative terminal 4 are each welded with a lead wire 6, and the silicon substrate 5 and the lead wire welded to the positive terminal 3 and the negative terminal 4 are Part 6 is plastic-sealed in the epoxy resin tube 7, and the epoxy resin tube 7 is coated with a layer of coating 8 that can clearly ...

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PUM

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Abstract

The invention relates to a silicone plastic package rectifier diode. The silicone plastic package rectifier diode comprises a diode main body which comprises a PN junction, a positive terminal and a negative terminal which are located on a same silicon substrate, the positive terminal and the negative terminal are respectively located at two ends of the silicon substrate, a leading-out line is respectively welded on the positive terminal and the negative terminal, the silicon substrate and partial leading-out lines welded with the positive terminal and the negative terminal are packaged in an epoxy resin tube in a plastic mode, and a coating capable of clearly displaying working parameters of the diode main body is coated outside the epoxy resin tube. The silicone plastic package rectifier diode is simple in structure, the diode main body is packaged in the epoxy resin tube in a plastic mode to guarantee that electrical characteristics of the diode main body are not influenced, the coating capable of clearly displaying working parameters of the diode main body is coated outside the epoxy resin tube to avoid changing into a tube which does not meet requirements for the working parameters when a new silicone plastic package rectifier diode is changed, and accordingly breakdown and damage of the silicone plastic package rectifier diode are avoided.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to a silicon plastic-encapsulated rectifier diode. Background technique [0002] Rectifier diode is the most basic semiconductor device, its main function is to convert alternating current into direct current, and it is widely used in various electronic circuits. In order to facilitate transportation and use, rectifier diodes are usually packaged in plastic packaging, and now silicon plastic rectifier diodes are most commonly used. When selecting silicon plastic-encapsulated rectifier diodes, parameters such as its maximum rectification current, maximum reverse operating current, cut-off frequency, and reverse recovery time should be considered. , it will cause breakdown damage to silicon plastic rectifier diodes. Contents of the invention [0003] The technical problem to be solved by the present invention is: based on the above problems, the present invention provides a silicon plasti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/861H01L23/29
CPCH01L24/01H01L2924/12036
Inventor 孔明
Owner 孔明
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