Modularized forming mold core for LED (light emitting diode) package injection mold

Abstract

The invention discloses a modularized forming mold core for an LED (light emitting diode) package injection mold. The modularized forming mold core comprises a forming mold core (1), a sub-mold core (2) and a mold core embedding base (3), wherein the sub-mold core is quadrangular integrally, one side of the bottom of the sub-mold core is provided with first hanging tables (9) which extend towards a side face to form a lug boss, the forming mold core is elongated integrally, first square holes (6) of which the shapes are adaptive to the shape of the sub-mold core are arranged along the length direction of the forming mold core equidistantly, the end face of the bottom of the forming mold core is provided with an opening groove for limiting the hanging table of the sub-mold core to upwards move, the opening groove forms a continuous opening groove channel along the length direction of the forming mold core, second hanging tables (10) which correspond to the first square holes in positions and extend towards a side face to form the lug boss are arranged in the bottom of one side of the forming mold core equidistantly, the mold core embedding base is cuboid integrally, second square holes (7) of which the shapes are adaptive to the shape of the forming mold core are evenly arranged in the mold core embedding base, and the bottom parts of the second square holes extend along the length direction of the mold core embedding base to form a groove (8) for limiting the second hanging tables of the forming mold core to upwards move.

Description

technical field [0001] The invention relates to an injection mold, in particular to a modular molding core for an LED packaging injection mold. Background technique [0002] With the continuous development of LED technology, the requirements for the shape, quality, product size and number of holes of injection molding products are constantly increasing, which will increase the processing difficulty and manufacturing cost of the mold. The original mold structure and processing technology are no longer suitable for the current situation. development requirements. The existing structural molding part is integral, and the molding part is easy to wear under high temperature and high pressure injection molding, so it is impossible to replace the local wearing parts, and only the whole molding part can be reprocessed, which not only affects the production progress of mold injection molding products Also increased the manufacturing cost of mold simultaneously. Contents of the inv...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is that the molding part of the existing injection mold for LED packaging is integral. Once worn out, the entire mold must be reprocessed, which is time-consuming, laborious and costly. To this end, a modular design is provided. Forming core, local wear only needs to replace the worn part without replacing the whole core

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