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Outer-lead-free lead frame strip of semiconductor encapsulation structure

A technology of lead frame strips and semiconductors, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., which can solve the problem that the gas cannot be discharged smoothly, and achieve the effect of avoiding the phenomenon of glue overflow

Active Publication Date: 2014-05-14
SUZHOU ASEN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The object of the present invention is to provide a lead frame strip with semiconductor package structure without external pins. The frame position is provided with an exhaust guide groove, which can improve the situation that the gas cannot be discharged smoothly in the film cavity, and effectively avoid the gas on the lead frame bar. Glue overflow occurs when setting the packaging material

Method used

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  • Outer-lead-free lead frame strip of semiconductor encapsulation structure
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  • Outer-lead-free lead frame strip of semiconductor encapsulation structure

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Embodiment Construction

[0015] In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments of the present invention are exemplified below and described in detail in conjunction with the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0016] Please refer to figure 2 As shown, it discloses a partial plan view of a lead frame strip of a semiconductor package structure without external leads according to an embodiment of the present invention. The present invention is mainly applied in improving the structure of lead frame strips for making semiconductor packaging structures without external lea...

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Abstract

The invention discloses an outer-lead-free lead frame strip of a semiconductor encapsulation structure. The outer-lead-free lead frame strip comprises a lead frame area block, at least one border area and a plurality of air vents, wherein the lead frame area block comprises a plurality of lead fame units arranged according to a matrix rule; the at least one border area is located on the periphery of the lead frame area block; and the plurality of air vents are formed in the border frame so as to exhaust surplus air in the lead frame area block during sealant pouring operation to prevent the phenomenon of sealant overflow.

Description

technical field [0001] The present invention relates to a lead frame strip for a semiconductor packaging structure without external leads, and in particular relates to a non-glue overflow that can avoid the occurrence of glue overflow due to unsmooth exhaust during the manufacturing process of packaging semi-finished products. Leadframe strips for semiconductor package construction with external leads. Background technique [0002] Nowadays, the semiconductor packaging structure usually uses a leadframe or a packaging substrate as a carrier for carrying chips. , SOP), quadflat package (quadflat package, QFP) or quad flat no-lead package (quad flat no-lead package, QFN), etc. [0003] Please refer to Figure 1A , 1B and 1C, which discloses a schematic diagram of the manufacturing process of a conventional quad flat no-lead package structure (QFN). Such as Figure 1A As shown, first prepare a lead frame strip 11, which is formed by etching a metal plate body. The lead fram...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495
CPCH01L24/97H01L2224/48091H01L2224/48247
Inventor 郭桂冠
Owner SUZHOU ASEN SEMICON CO LTD
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