A novel stirring device for wafer polishing solutions
A stirring device and grinding liquid technology, applied in the direction of mixer accessories, dissolving, mixing machines, etc., can solve the problems of reducing the cutting quality of silicon wafers, and achieve the effects of improving cutting quality, changing flow direction, and improving quality
Inactive Publication Date: 2013-04-24
ZHENJIANG GANGNAN ELECTRIC
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Problems solved by technology
When the stirring blade of this structure is stirring, the particles in the grinding liquid are easy to concentrate to the periphery of the cylinder, which is easy to affect the quality of the grinding liquid, thus greatly reducing the quality of silicon wafer cutting
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[0011] The present invention will be further described below in conjunction with accompanying drawing.
[0012] As shown in the figure, in order to solve the above-mentioned technical problems, a new type of stirring device for silicon wafer grinding liquid in the present invention includes a stirring shaft 2 and a stirring blade 1, and the stirring blade 1 is vertically fixed on the lower end of the stirring shaft 2. The stirring blade 1 comprises a connecting portion 11, the edge of the connecting portion 11 is evenly provided with a circular arc convex surface 3, each of the circular arc convex surfaces 3 is provided with a corresponding stirring piece 4, and the stirring piece 4 is connected to the The arc convex surface 3 is vertically connected. The included angle β between adjacent arc convex surfaces is 120°. The agitating blade 4 is composed of several plates 41, which are fixed parallel to each other and integrated into one body, and the gap α between the adjacent p...
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The present invention discloses a novel stirring device for wafer polishing solutions, including a stirring shaft and a stirring blade. The stirring blade is vertically fixed on the lower end of the stirring shaft, and includes a connection portion. The edge of the connection portion is uniformly provided with circular arc convexes, each of the convexes is provided with a corresponding stirring sheet, and the stirring sheet is in vertical connection with the circular arc convex. Because the stirring blade includes the connection portion, the edge of the connection portion is uniformly provided with circular arc convexes, each of the convexes is provided with the corresponding stirring sheet, and the stirring sheet is in vertical connection with the circular arc convex, while stirring, via stirring by using the circular arc convexes of the stirring sheet edges and the stirring sheets, longitudinal and transverse stirring are formed, thereby not only increasing the stirring area, but also altering the flow direction of particulate matters, so that the particulate matters in the polishing solution are more uniformly dispersed, greatly improving the cutting quality of wafers.
Description
technical field [0001] The invention relates to a stirring device, in particular to a stirring device for silicon wafer grinding liquid, and belongs to the technical field of silicon wafer processing. Background technique [0002] During the processing of silicon wafers, in order to ensure the design requirements of silicon wafers, silicon wafers are required to be ground. In the prior art, manual stirring is generally used for the grinding fluid required for silicon wafer processing. On the one hand, this method tends to cause uneven stirring of the grinding liquid, on the other hand, manual operation has low efficiency, and the labor intensity of the operators is high. [0003] Recently, a stirring device has appeared, which includes a stirring blade and a stirring shaft, the stirring blade and the stirring shaft are vertically fixed into one body, and the stirring blade is a leaf-shaped member. When the stirring blade of this structure stirs, the particles in the grindi...
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IPC IPC(8): B01F15/00
Inventor 聂金根
Owner ZHENJIANG GANGNAN ELECTRIC