Lamination-structured heat sink material and preparation method

Abstract

The invention discloses a lamination-structured heat sink material, and relates to a metal-based planar layered composite type electronic packaging material applied to microelectronic packaging. The material comprises three compounded layers of copper, molybdenum-copper or tungsten copper, and copper; the material is prepared in one step by infiltrating and compounding with the copper; the purpose that the copper component in the molybdenum-copper or the tungsten copper at the middle layer is integrally molten with copper layers on two surfaces is achieved, so that the boundary bonding capability is improved, and at the same time the preparation process is simplified.

Description

technical field [0001] The invention relates to a metal-based plane layered composite electronic packaging material for microelectronic packaging, including: copper / tungsten copper / copper (C / W / C), copper / molybdenum copper / copper (C / P / C) metal Improvement of thermal conductivity of composite heat sink material. Background technique [0002] Cu / MoCu / Cu composite laminates (CPC for short) and Cu / Mo / Cu composite laminates (CMC for short), because of their excellent thermal conductivity and adjustable thermal expansion coefficient, and can match Be0 and Al203 ceramics, are currently Electronic packaging materials are the first choice for high-power electronic components. This type of material is made of copper with relatively high thermal conductivity on both sides, and a molybdenum layer material with low thermal conductivity in the middle (molybdenum or molybdenum-copper alloy), which is a planar laminate made by hot rolling (such as Chinese patents CN1843691, CN1850436), expl...

AI Technical Summary

Problems solved by technology

Secondly, the laminated composite structure has limited interface bonding strength, and the substrate is often subjected to thermal stress cycles during use. The thermal expansion coefficients of copper and molybdenum are different (the thermal expansion coefficient of copper is about three times that of molybdenum). , copper and molybdenum elongate or shrink differently along the direction of the composite interface, resulting in tensile stress. When the tensile stress reaches a certain level, microcracks or bubbling will occur on the bonding interface. In severe cases, the interface will be separated on a large scale and the service life will be shortened. , and even lead to composite heat sink material failure

At the same time, there is also uneven thickness of the upper and lower copper layers. When the error exceeds 0.05mm, due to the inconsistent thickness of the two layers of copper, stress will be generated after brazing with the ceramic frame, causing the heat sink material to deform and bend.