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Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of multi-exposure time, etc., and achieve the effect of excellent resolution and excellent adhesion

Active Publication Date: 2017-11-17
RESONAC CORPORATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned direct drawing exposure method, in addition to using monochromatic light such as laser light as a light source, light is irradiated while scanning the substrate, so there is a need for more work than the conventional exposure method through a photomask. Exposure Time Tendency

Method used

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  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board
  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board
  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~10 and comparative example 1~3

[0136] (Preparation of Solution of Photosensitive Resin Composition)

[0137] The components shown in following Table 1 were mixed in the compounding quantity shown in the table, and the solution of the photosensitive resin composition of Examples 1-10 and Comparative Examples 1-3 was prepared. In addition, the compounding quantity of (A) component shown in Table 1 and Table 2 is the mass (amount of solid content) of a non-volatile matter. The details of each component shown in Tables 1 and 2 below are as follows.

[0138]

[0139] [Synthesis of Binder Polymer (A-1)]

[0140] 150g of methacrylic acid, 125g of benzyl methacrylate, 25g of methyl methacrylate and 200g of styrene (mass ratio 30 / 25 / 5 / 40) and azobisisobutyl The solution obtained by mixing 9.0 g of nitriles was referred to as "solution a".

[0141] The solution obtained by dissolving 1.2 g of azobisisobutyronitrile in 100 g of a mixed liquid (mass ratio 3:2) of 60 g of methyl cellosolve and 40 g of toluene was r...

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Abstract

The present invention relates to a photosensitive resin composition, a photosensitive element, a method for forming a resist pattern, and a method for manufacturing a printed circuit board. The photosensitive resin composition contains (A) a binder polymer, (B) a photo A polymeric compound and (C) photoinitiator. (C) Photoinitiator contains the compound represented by following formula (1). In the formula, R1 and R2 each independently represent a group represented by the following formula (1a) or (1b), R each independently represent an alkyl or phenyl group with 1 to 20 carbon atoms, and multiple Rs that exist can be The same can also be different.

Description

field of invention [0001] The present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for forming a resist pattern, and a method for manufacturing a printed wiring board. Background technique [0002] In the field of production of printed wiring boards, photosensitive resin compositions are widely used as resist materials used for etching or plating. The photosensitive resin composition is often used as a photosensitive element (laminate) comprising a support film and a layer formed on the support film using the photosensitive resin composition (hereinafter referred to as "photosensitive element"). permanent resin composition layer"). [0003] The printed circuit board is manufactured, for example, as follows. First, the photosensitive resin composition layer of the photosensitive element is laminated (laminated) on the circuit-forming substrate (lamination process). Next, after peeling and removing the support fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033G03F7/09G03F7/00H05K3/06
CPCG03F7/0035G03F7/09C08F212/08C08F257/02C08F220/288C08F220/06C08F220/1807C08F220/14C08F220/286C08F220/58C08F220/282
Inventor 宫坂昌宏锻治诚村上泰治印杰姜学松李宝
Owner RESONAC CORPORATION
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