Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Board card pressure relieving device for liquid-cooled computer

A pressure relief device and computer technology, applied in computing, instrumentation, electrical and digital data processing and other directions, can solve the problems of low reliability and complex structure, and achieve the effect of high reliability, simple structure and solving the problem of cooling liquid pressure relief.

Active Publication Date: 2013-05-01
AVIC NO 631 RES INST
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a liquid-cooled computer board card pressure relief device, which mainly solves the problems of complex structure and low reliability of the existing liquid-cooled computer board card pressure relief device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Board card pressure relieving device for liquid-cooled computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] To solve the problems of complex structure, low reliability, and heat-dissipating shell of the liquid-cooled computer board pressure relief device, the general idea is to reserve some space on the heat-dissipating shell. If the volume of cooling liquid increases, the increased part can be occupied The space reserved on the heat dissipation shell, so as to avoid damage to the heat dissipation shell due to temperature rise.

[0015] Based on the above ideas, the present invention provides a simple structure to achieve the purpose, which is as follows: the liquid-cooled computer board pressure relief element includes a heat dissipation housing arranged in the liquid-cooled computer, one side of the heat dissipation housing and a heat conduction pad One side is closely attached, and the other side of the heat conduction pad is closely attached to the heating chip for heat conduction. The heating chip is arranged on the printed board, and the printed board is fixedly arranged...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a board card pressure relieving device for a liquid-cooled computer, which mainly solves the problems of complex structure and low reliability of the existing board card pressure relieving device for the liquid-cooled computer. The board card pressure relieving device for the liquid-cooled computer, which is provided by the invention, comprises a heat dissipating shell arranged in the liquid-cooled computer, wherein one end part of a cooling liquid flow channel of the heat dissipating shell is provided with a pressure relieving element; the pressure relieving element is fixedly arranged on the heat dissipating shell and forms a sealed cooling liquid flow channel with the heat dissipating shell; the pressure relieving element is a rubber pressure relieving element which cannot be corroded by cooling liquid; and a blind hole contacted with external air is arranged in the pressure relieving element. The board card pressure relieving device for the liquid-cooled computer, which is provided by the invention, has the advantages of simple structure and high reliability, and the problem of cooling liquid pressure relief occurring after the heat dissipating shell of a board card is heated is effectively solved.

Description

technical field [0001] The invention relates to a pressure relief device for a liquid-cooled computer board, which belongs to the structure of avionics equipment. Background technique [0002] With the development of microelectronics technology, the power consumption of chips is getting higher and higher, and the traditional natural heat dissipation and forced air cooling can no longer solve the heat dissipation problem of chips. Compared with air, the specific heat capacity of liquid is many times higher, so liquid cooling is a better way to solve the heat dissipation of high power consumption chips. The computer is cooled by liquid, and the heat on the board is generally taken away by the liquid flowing inside the heat dissipation housing of the computer board. As a result, the coolant fills the cooling case of the board and the coolant channels of the computer case. [0003] Expansion with heat and contraction with cold is an inherent property of matter, and cooling liq...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 杨明明董进喜赵亮白振岳郭建平
Owner AVIC NO 631 RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com