A liquid-cooled computer board card pressure relief device
A pressure relief device and computer technology, applied in computing, instrumentation, electrical and digital data processing and other directions, can solve the problems of low reliability and complex structure, and achieve the effect of high reliability, simple structure and solving the problem of cooling liquid pressure relief.
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[0014] To solve the problems of complex structure, low reliability, and heat-dissipating shell of the liquid-cooled computer board pressure relief device, the general idea is to reserve some space on the heat-dissipating shell. If the volume of cooling liquid increases, the increased part can be occupied The space reserved on the heat dissipation shell, so as to avoid damage to the heat dissipation shell due to temperature rise.
[0015] Based on the above ideas, the present invention provides a simple structure to achieve the purpose, which is as follows: the liquid-cooled computer board pressure relief element includes a heat dissipation housing arranged in the liquid-cooled computer, one side of the heat dissipation housing and a heat conduction pad One side is closely attached, and the other side of the heat conduction pad is closely attached to the heating chip for heat conduction. The heating chip is arranged on the printed board, and the printed board is fixedly arranged...
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