Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer cleaning device and process thereof

A wafer cleaning and wafer technology, which is applied to electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of rising unit price of wafer manufacturing, achieve the effects of reducing manufacturing unit price, improving cleaning power, and shortening the required time

Inactive Publication Date: 2013-05-01
SMARTRON
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, since the wafer cleaning process requires the use of a neutral detergent, there is a problem that the wafer manufacturing unit price increases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer cleaning device and process thereof
  • Wafer cleaning device and process thereof
  • Wafer cleaning device and process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Hereinafter, configurations of embodiments of the present invention will be described with reference to the drawings.

[0030] First, refer to figure 2 The wafer cleaning apparatus 1 according to the embodiment of the present invention generally includes a setting unit 10 , a first cleaning unit 20 , a second cleaning unit 30 , a drying unit 40 , a transfer unit 50 and a control unit 60 .

[0031] First, the setting part 10 is a structural component for the first cleaning part 20 , the second cleaning part 30 , the drying part 40 , the transfer part 50 and the control part 60 hereinafter, and is formed by combining horizontal frames and vertical frames.

[0032] In addition, the first cleaning unit 20 is fixedly installed on the installation unit 10. The first cleaning unit 20 is a component for cleaning the wafer W stored in the cassette C using ultrapure water and nitrogen foam, and includes a immersion unit 21 and a foam nozzle. (Bubble Nozzle) 27.

[0033] here, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a wafer cleaning device and a process thereof, and particularly, to the wafer cleaning device which can totally eliminate wafer particles for providing high-quality wafers in the cleaning process for removing the wafer particles and the process thereof.

Description

technical field [0001] The present invention relates to a wafer cleaning device and its process method. More specifically, it relates to a wafer cleaning device and a wafer cleaning device capable of completely removing the above-mentioned particles without using a neutral detergent in the cleaning process for removing wafer particles to provide high-quality wafers. process method. Background technique [0002] Generally, the wafer manufacturing process includes a wafer polishing process using chemical / mechanical polishing equipment (CMP equipment) and a wafer cleaning process for removing particles (Particles) that are impurities generated in the wafer polishing process. [0003] In this wafer cleaning process, in order to improve the cleaning power of the transport type horizontal brush, such as figure 1 As shown, neutral detergents such as chemicals are added to the cleaning process several times to remove wafer particles as the final process. [0004] However, in this ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
Inventor 高台镐
Owner SMARTRON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com