Circuit board distressing method and circuit board destressing equipment

Abstract

The invention relates to a circuit board destressing method and circuit board destressing equipment. The circuit board destressing method includes the following step of providing a substrate, providing the destressing equipment, wherein at least three temperature zones are arranged on the destressing equipment in the length direction of the destressing equipment, heating the destressing equipment to enable the temperature of each temperature zone to be within 129.5DEG C-351DEG C, enabling the temperature of the temperature zone arranged in the middle of the destressing equipment to be higher than the temperature of the temperature zone close to an outlet of the distressing equipment and the temperature zone close to an inlet of the distressing equipment, and enabling the substrate to pass by the distressing equipment at a speed of 0.2 -3.0 meter per minute. The circuit board destressing method and the circuit board destressing equipment can eliminate the stress of the substrate and guarantee that the size of the expansion and contraction of the substrate is maintained within a controllable range.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board stress relief method and circuit board stress relief equipment. Background technique [0002] At present, as the market demand for consumer electronics products (including mobile phones, notebook computers, digital cameras, game consoles, etc.) and multifunctional direction. The substrate is the basic material for manufacturing printed circuit boards. Usually, the substrate is made of copper clad laminate, which is impregnated with a resin adhesive with a reinforcement material (Reinforcement Material), and through drying, cutting, curing and other processes, It is then laminated into a billet, and then covered with copper foil, using a steel plate as a mold, and processed by high-temperature and high-pressure forming in a hot press. [0003] However, during the drying and curing processes of the substrate, stress is often accumulated inside it. If the ab...

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Problems solved by technology

[0003] However, during the drying, curing and other processes of the substrate, stress often accumulates inside it. If the above stress cannot be well released, it is likely to cause the substrate to bend in a stressful environment, and may also cause the substrate to crack

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