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Bulk molding compound (BMC) electric heating floor tile

A technology for electric heating floor tiles and floor tiles, which is applied in electric heating systems, heating methods, household heating, etc., can solve the problems of high structural floor and unfavorable bathroom drainage, etc., and achieves the effects of strong decoration, safe and reliable use, and moderate heating temperature.

Inactive Publication Date: 2013-05-15
MILIKUDO GLASS FIBER REINFORCED PLASTIC TAIZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The overall structural layer of this method is relatively thick, which is not a problem for the decoration of new houses, but if it is for the second decoration of the old house, it is easy to make the overall structural layer higher, which is not conducive to the drainage of the bathroom

Method used

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  • Bulk molding compound (BMC) electric heating floor tile

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Embodiment Construction

[0014] Such as figure 1 As shown, the BMC electric heating floor tile is composed of a floor tile main body 1, an electric heating device and a wire 3, the electric heating device is a semiconductor heating sheet 2, and the semiconductor heating sheet 2 is arranged in the middle of the floor tile main body 1, and one end of the wire 3 is connected to the The semiconductor heating sheet 2 is connected. The floor tile main body 1 of this embodiment is made of BMC material, and the BMC material encapsulates the semiconductor heating sheet 2 and the wire 3 in the inside of the floor tile main body 1 by molding, and forms an integral structure. stick out.

[0015] In this embodiment, the heating temperature of the semiconductor heating sheet 2 is 45°C to 60°C. The surface of the floor tile main body 1 is also provided with a layer of decorative material 4, and the wire 3 is a silicone insulated wire. The present invention adopts an integral molding structure, and the semiconduct...

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Abstract

The invention relates to a bulk molding compound (BMC) electric heating floor tile which is composed of a floor tile body, an electric heating device and a wire. The electric heating device comprises an electric heating piece which is arranged in the middle of the floor tile body, and one end of the wire is connected with the electric heating piece. The floor tile body is made of BMC materials which are used for packaging the electric heating piece and the wire in the floor tile body through compression molding forming to form an integrated structure, and the other end of the wire stretches out of the side face of the floor tile body. The electric heating piece is a semiconductor heating piece with the heating temperature of 45-60 DEG C. Compared with the prior art, the BMC materials are used for manufacturing the electric heating floor tile in the integrated structure through the compression molding forming, when the electric heating floor tile is used in a toilet or a bathroom, the thickness of the integrated structure can be small, and the floor tile can be better applied to different decoration conditions. The BMC electric heating floor tile is strong in decoration performance, moderate in heating temperature, convenient to mount, and safe and reliable to use.

Description

technical field [0001] The invention relates to an electric heating floor tile, in particular to an electric heating floor tile with an integral structure which adopts BMC material and is molded. Background technique [0002] BMC is a bulk unsaturated polyester glass fiber reinforced molding compound, also known as thermosetting bulk molding compound. Its main raw materials are chopped glass fiber (GF), unsaturated polyester resin (UP), filler (MD), and various A prepreg in the form of a lump made by thoroughly mixing two kinds of additives. Belonging to one of the thermosetting molding materials, BMC materials have excellent electrical properties, mechanical properties, heat resistance, and chemical corrosion resistance, and are suitable for various molding methods such as compression molding, injection molding, and transfer molding. BMC material formula It can be adjusted flexibly and can meet the performance requirements of various products. It is mainly used in the fiel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D13/00E04F15/10
Inventor 王学军胡志荣
Owner MILIKUDO GLASS FIBER REINFORCED PLASTIC TAIZHOU
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