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Circuit board and manufacture method thereof

A production method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuit, and chemical/electrolytic method to remove conductive materials, etc., can solve the problem of difficult control of drilling and electroplating precision, high production cost of circuit boards, and failure of circuit boards. The problem of high rate, to avoid reliability risks and save costs

Inactive Publication Date: 2013-05-15
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the one hand, large-scale equipment such as drilling equipment and electroplating equipment are expensive, resulting in higher production costs for circuit boards; on the other hand, it is not easy to control the accuracy of drilling and electroplating, and the failure rate of the produced circuit boards is relatively high.

Method used

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  • Circuit board and manufacture method thereof
  • Circuit board and manufacture method thereof
  • Circuit board and manufacture method thereof

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Embodiment Construction

[0024] The manufacturing method of the double-sided circuit board provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] The manufacturing method of the double-sided circuit board provided by this technical solution comprises steps:

[0026] first step, such as figure 1 As shown, a first copper foil 10 having opposing first and second surfaces 101 and 102 is provided. The first copper foil 10 may be a rolled copper foil, and its thickness may be 12 microns to 120 microns.

[0027] In the second step, please also refer to the Figure 2 to Figure 5 , etching the first copper foil 10 from the first surface 101 to remove a part of the first copper foil 10 close to the first surface 101 so as to form the first copper foil 10 into an intermediate structure 12 . The intermediate structure 12 includes a base 120 close to the second surface 102 and a plurality of first protrusions 121 exten...

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Abstract

The invention provides a manufacture method of a double-faced circuit board. The manufacture method of the double-faced circuit board comprises the following steps: providing first copper foil which is provided with a first surface and a second surface, wherein the first surface and the second surface are opposite to each other; etching the first copper foil from the first surface to form a middle structure, wherein the middle structure comprises a base and a plurality of first protrusions, and each protrusion is exposed on the first surface; filling insulating materials among the plurality of first protrusions; pressing fit second copper foil on the first surface; etching the middle structure from the second surface to form a plurality of second protrusions which are exposed on the second surface, wherein the plurality of second protrusions are respectively connected with the plurality of first protrusions in a corresponding mode so as to form a plurality of copper cylinders; filling the insulating materials among the plurality of second protrusions; pressing fit third copper foil on the second surface; using the second copper foil to form a second line pattern, and using the third copper foil to form a third line pattern, wherein the second line pattern and the third line pattern are electrically connected through the plurality of copper cylinders. According to the technical scheme, the manufacture method of the double-faced circuit board is in no need of manufacturing through holes.

Description

technical field [0001] The invention relates to circuit board technology, in particular to a circuit board which can be stored for a long time and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, circuit boards are widely used in electronic products. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Double-sided circuit boards and multi-layer circuit boards generally realize electrical conduction between circuits of each layer through a plated through hole (Plated Through Hole, PTH). The production of via holes needs to go through processes such as drilling, blackening or electroless plating, and electroplating. However, on the one hand, large-scale equi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/40
CPCH05K2203/1572H05K3/4038H05K3/06H05K2203/0323H05K3/40Y10T29/49146
Inventor 刘瑞武
Owner AVARY HLDG (SHENZHEN) CO LTD
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