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Selective wave soldering device

A wave soldering, selective technology, applied in the direction of assembling printed circuits with electrical components, metal processing, etc., can solve problems affecting mounted components and so on

Inactive Publication Date: 2013-05-22
XIAN ZHONGKEMAITE ELECTRONICS TECH EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic products, according to the requirements of various functions, the requirements for the soldering position of the components on the PCB are getting higher and higher. There are all through-hole plug-in PCBs, all patch PCBs, and plug-in mixed PCBs. The current The process is that all through-hole plug-in PCBs are soldered with a wave soldering machine; all patch PCBs are soldered with a reflow soldering machine; there are two types of plug-in mixed PCBs, and the plug-in mixed components on the same side of the PCB are first soldered with a reflow soldering machine Mount the components, and then solder the plug-in components with a wave soldering machine; if the plug-in mixed components are not on the same side of the PCB, first use the reflow soldering machine to solder the mounted components, and then manually solder the plug-in components, because if you use a wave soldering machine to solder the plug-in components Mounted components will affect soldered mounted components

Method used

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Embodiment Construction

[0010] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0011] As shown in the drawings, the present invention is a selective wave soldering device, comprising a tin furnace 1, a template nozzle 2 is arranged on the tin furnace 1, the template nozzle 2 communicates with the pump chamber 9, a PCB board 3 is located on the template nozzle 2, and the tin A thermocouple 4 and a heating resistance wire 8 are arranged in the furnace 1, and the tin furnace 1 is connected to a circuit control box 6, and a control panel 5 is arranged on the circuit control box 6, and an electromagnetic pump groove 10 and an electromagnetic pump 11 are arranged in the circuit control box 6.

[0012] Heating control and electromagnetic pump control originals are installed in the circuit control box 6, and the temperature control instrument of temperature control and the peak switch and the peak adjustment knob of controlling t...

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Abstract

The invention provides a selective wave soldering device which comprises a solder machine. A template nozzle is arranged on the solder machine and is communicated with a pump cavity. A printed circuit board (PCB) is located on the template nozzle. A thermocouple and a resistive heater are arranged in the solder machine which is connected with a circuit control box. A control panel is arranged on the circuit control box, and an electromagnetic pump ditch and an electromagnetic pump are arranged in the circuit control box. The selective wave soldering device provides a set of complete control device for a selective crest welder, and has the advantages of simple structure and convenient usage.

Description

technical field [0001] The invention relates to the control field of selective wave soldering machines, and more specifically provides a selective wave soldering device. Background technique [0002] With the development of electronic products, according to the requirements of various functions, the requirements for the soldering position of the components on the PCB are getting higher and higher. There are all through-hole plug-in PCBs, all patch PCBs, and plug-in mixed PCBs. The current The process is that all through-hole plug-in PCBs are soldered with a wave soldering machine; all patch PCBs are soldered with a reflow soldering machine; there are two types of plug-in mixed PCBs, and the plug-in mixed components on the same side of the PCB are first soldered with a reflow soldering machine Mount the components, and then solder the plug-in components with a wave soldering machine; if the plug-in mixed components are not on the same side of the PCB, first use the reflow sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00H05K3/34
Inventor 张国琦蒲维新
Owner XIAN ZHONGKEMAITE ELECTRONICS TECH EQUIP