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Anisotropic Conductive Film

An anisotropic, conductive film technology, applied to the conductive layer on the insulating carrier, printed circuit, printed circuit, etc., can solve the problem of short circuit or increased connection resistance, inability to identify anisotropic conductive film, and insufficient adhesion strength of circuit components And other issues

Active Publication Date: 2017-05-03
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because a typical multilayer anisotropic conductive film includes an adhesive layer with a low melt viscosity, conductive particles contained in the adhesive layer are not located between circuit terminals but flow into adjacent spaces, causing short circuits or connections Increased resistance
Another problem with multilayer anisotropic conductive films is insufficient adhesion strength between circuit components
Furthermore, the high transparency of the insulating adhesive layer without conductive particles makes it impossible to recognize the presence of the anisotropic conductive film after pre-pressing the film on circuit components

Method used

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Examples

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Effect test

Embodiment 1-2 and comparative example 1-3

[0077] The present invention will be better understood from the following examples and comparative examples (see Table 1). These examples are provided for illustrative purposes only and are not intended to limit the scope of the invention, which is defined by the appended claims.

[0078]

Embodiment 1

[0080] Using 40 wt% urethane resin (D-ACE-540T, Dongsung Chemical (Korea)) in toluene solution (solid content: 50%), 10 wt% phenoxy resin (E4275, Japan Epoxy Resins Co., Ltd .) of methyl ethyl ketone (MEK) solution (solid content: 40%), 40wt% epoxy (meth)acrylate (SP1509, Showa Highpolymer), 2wt% 2-methacryloyloxyethyl phosphate, 3wt% % of pentaerythritol tri(meth)acrylate, 3 wt% of 2-hydroxyethyl (meth)acrylate and 2 wt% of benzoyl peroxide to form a 25 μm thick insulation with a minimum melt viscosity of 2,000 Pa s Adhesive layer.

[0081]Using 10 wt% of acrylonitrile-butadiene resin (Nipol1072, Nippon Zeon) in toluene solution (solid content: 25%), 10 wt% of urethane resin (D-ACE-540T, Dongsung Chemical (Korea)) Toluene solution (solid content: 50%), 25 wt% MEK solution (solid content: 40%) of phenoxy resin (E4275, Japan Epoxy Resins Co., Ltd.), 30 wt% epoxy (meth)acrylic acid Esters (SP1509, Showa Highpolymer), 2wt% of 2-methacryloyloxyethyl phosphate, 8wt% of pentaeryth...

Embodiment 2

[0084] In addition to the use of 2-hydroxyethyl (meth)acrylate and 3-glycidyloxypropyltriethoxysilane in amounts of 2 wt% and 1 wt%, respectively, an insulating adhesion with a minimum melt viscosity of 2,000 Pa·s was formed. layer, an anisotropic conductive film was produced in the same manner as in Example 1.

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Abstract

The present invention relates to an anisotropic conductive film comprising an insulating layer, as well as a conductive layer which is stacked on the insulating layer and which contains conductive particles, wherein the conductive film has a minimum melt viscosity that is greater than the minimum melt viscosity of the insulating layer. According to the present invention, short circuits among conductive particles may be prevented, contact resistance may be reduced, improved adhesion among circuit members is provided, and the visibility of the anisotropic conductive film is significantly improved.

Description

technical field [0001] The present invention relates to an anisotropic conductive film. More specifically, the present invention relates to an anisotropic conductive film comprising an insulating layer and a conductive layer laminated on the insulating layer and containing conductive particles, characterized in that the conductive layer has a minimum melt viscosity greater than that of the insulating layer. melt viscosity. Background technique [0002] Anisotropic conductive film (ACF) generally refers to conductive particles such as metal particles (e.g. nickel (Ni) or gold (Au) particles) or metal-coated polymer particles dispersed in it to conduct electricity in the z-axis direction and in the Films that are insulating in the x-y plane. [0003] When this anisotropic conductive film is placed between circuits and then heat-pressed under suitable conditions, circuit terminals facing each other are electrically connected by conductive particles, and insulating adhesive re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14
CPCH05K3/323G02F1/13452H01B1/22H05K2201/10128
Inventor 朴憬修李佑硕林佑俊李京秦金奉龙朴镇晟鱼东善
Owner KUKDO ADVANCED MATERIALS CO LTD