Manufacturing Technology of In-mold Injection Molding Circuit

Abstract

The invention relates to the technical field of circuit printing technology, in particular to manufacture technology of a printing circuit. The manufacture technology of inlaying an injection circuit in a mold comprises the manufacture technology of a printing circuit film and further comprises film molding integration technology. The printing circuit film is embedded into a mold cavity of an injection mold and formed together with plastics in a molten state in an injection mode, and an integration injection part is manufactured. By the adoption of the technical scheme, the film and plastic gluing technology is once completed in an injection mold. The printed circuit film and a main molding part body are firmly integrated, and the manufacture technology of inlaying the injection circuit in the mold has the advantages that the printed circuit film does not desquamate and not to be oxidated without escaping of small solvent molecules and the like.

Description

technical field [0001] The invention relates to the technical field of circuit printing, in particular to a manufacturing process of a printed circuit. Background technique [0002] At present, the thin-film printed circuit used in the electronics industry is generally bonded with double-sided tape to the main plastic parts. There is a problem of uneven adhesion in this way of bonding. There are local gaps in the film and plastic bonding parts, which are easy to be oxidized and the small molecules of the adhesive solvent are easy to volatilize in the air to cause pollution, which is easy to degumming after a long time. In the production process, there are problems such as high labor cost, low production efficiency, high rejection rate and high production cost. Furthermore, the limitation of the internal space of a large number of micro-appliances makes the operation possibility of bonding the double-sided tape for thin-film printed circuits with the plastic main part very u...

AI Technical Summary

Problems solved by technology

This method of bonding has the problem of unevenness. There are local gaps in the film and plastic bonding parts, which are easy to oxidize and the small molecules of the adhesive solvent are easy to volatilize in the air and cause pollution. It is easy to degumming after a long time.

In the production process, there are problems such as large labor costs, low production efficiency, high scrap rate, and high production costs.

Furthermore, the limitation of the internal space of a large number of micro-electrical appliances makes it very unlikely that the film printed circuit will be bonded to the plastic main part with double-sided adhesive tape.

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