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Opposite pasting system

A technology of laminating and positioning holes, applied in layered products, lamination auxiliary operations, lamination and other directions, can solve problems such as difficulty in achieving accuracy, lamination offset, lamination difficulty, etc. location-accurate effect

Active Publication Date: 2015-06-10
SUZHOU BRIDGE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of manual lamination are obvious: First, manual operation is prone to produce various defective products. For example, if the material to be laminated is too thin, it is easy to cause lamination difficulty and lamination deviation.
Secondly, the standardization of manual lamination is difficult to control, because there are always errors in manual operation, and it is difficult to achieve a high level of accuracy
Third, the accuracy of manual lamination also largely depends on the operator's technical level and experience, and there are also deviations in operating proficiency and mastery of accuracy.
Fourth, manual lamination requires more personnel, which will undoubtedly increase the labor cost for enterprises

Method used

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Examples

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Embodiment Construction

[0019] The sticking system of this embodiment includes a flat-knife punching device for performing flat-knife punching on the substrate to be bonded, and a circular-knife pair for positioning and bonding the substrate to be bonded after being processed by the flat-knife punching device. A sticking device, the substrate to be pasted includes two parts: a substrate to be pasted 1 and a substrate to be pasted 2, the two parts are punched by a flat-knife punching device and pasted by a circular-knife opposite-applying device.

[0020] see Figure 1a and Figure 1b As shown, the flat knife punching device includes a flat knife die that can punch out a first positioning hole 31 and a knife line 32 on the upper end face of the substrate to be bonded. The flat knife mold includes a flat knife A mold 3 and a flat knife B mold respectively. 4. A first positioning column (not shown in the figure) that can punch out a first positioning hole 31 is provided at the cutting edge of the flat...

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PUM

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Abstract

The invention relates to an opposite pasting system. The opposite pasting system comprises a flat cutter punching device for carrying out flat cutter punching on a base material to be pasted, and a round cutter opposite pasting device for carrying out round cutter positioning and pasting on the base material to be pasted after the treatment by the flat cutter punching device; the base material to be pasted comprises two parts; and the two parts are respectively pasted and assembled into a finished product through the flat cutter punching device and the round cutter opposite pasting device. According to the opposite pasting system disclosed by the invention, a first positioning hole and a cutter receiving line are punched out in the surface of the base material to be pasted through a flat cutter mold, a second positioning hole and a second positioning column in the round cutter mold are aligned to the first positioning hole so as to position the first positioning hole, and a machine is utilized for pasting and assembling after the position of the base material to be pasted is adjusted and fixed. Through the utilization of a product after pasting by the system disclosed by the invention, the position is accurate, and simple, the quick and accurate pasting process of the machine is realized without any redundant component.

Description

technical field [0001] The invention relates to a bonding system, in particular to a system for machine bonding of substrates to be bonded during the die-cutting process. Background technique [0002] The field of die-cutting technology is one of the industries that has developed rapidly in recent years. The traditional die-cutting technology is mainly applied to the cutting of the post-processing of printed matter. With the development of the electronics industry, especially the expansion of electronic consumer products, die-cutting has become an important way of processing auxiliary materials for industrial electronic products. [0003] In the bonding process, the traditional method is to use manual bonding, that is, the products are stamped and cut and then manually bonded and assembled. However, the disadvantages of manual lamination are obvious: First, manual operation is prone to produce various defective products. For example, if the material to be laminated is too t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B38/00
Inventor 顾为华王勤其他发明人请求不公开姓名
Owner SUZHOU BRIDGE ELECTRONICS