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Large and medium power LED car lamps and manufacturing method thereof

A technology of LED car lights and manufacturing methods, which is applied in the direction of cooling/heating devices of motor vehicles, road vehicles, and lighting devices, and can solve problems such as easy heat accumulation, unfavorable LED heat dissipation, and LED failure, so as to solve heat dissipation problems and solve Effect of LED failure and simplified packaging

Active Publication Date: 2016-01-06
SHANGHAI SEEYAO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the trend of electronic products becoming shorter and smaller, many different components are usually densely welded on the wiring board, so that other components are densely arranged around the LED device, which is not conducive to the heat dissipation of the LED; in addition , use epoxy or silicone material as the shell to encapsulate the LED device, the light transmission is not very good, and there will be stress, easy to heat up, and the LED will fail with the accumulation of heat

Method used

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  • Large and medium power LED car lamps and manufacturing method thereof
  • Large and medium power LED car lamps and manufacturing method thereof

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Embodiment Construction

[0020] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0021] see figure 1 , is a flow chart showing the operation of the LED vehicle lamp manufacturing method of the present invention, and the LED vehicle lamp manufacturing method of the present invention will be described in detail below.

[0022] Such as figure 1 As shown, step S10 is first performed to provide an aluminum-based PCB board and a silicon-glass bonded light-transmitting cap, wherein the silicon-glass-bonded light-transmi...

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Abstract

The invention provides a large and medium power light emitting diode (LED) vehicle lamp and a manufacture method thereof. An aluminum base printed circuit board (PCB) is independently provided. An LED chip and an LED driving circuit are respectively welded on the aluminum base PCB. A light permeable cap bonded through silicon glass is covered outside the LED chip. Light permeability is good, stress is not generated and therefore the problem that an LED loses effectiveness due to the stress is solved. In addition, the whole LED vehicle lamp is independently manufactured. Compared with the prior art, the LED vehicle lamp does not need to be welded on the same distributing board with other components and the problem of heat dissipation of the LED is effectively solved.

Description

technical field [0001] The invention relates to an LED vehicle lamp, in particular to a high-power and medium-power LED vehicle lamp and a manufacturing method thereof. Background technique [0002] LED lights are generally welded on the wiring board with LED devices. The wiring board is usually a PCB board or a metal frame, and the housing made of epoxy or silicone material is used to encapsulate the LED device. In addition, such as constant current and constant voltage protection LED The driving circuit of the element is also welded on the above-mentioned wiring board. [0003] However, with the trend of electronic products becoming shorter and smaller, many different components are usually densely welded on the wiring board, so that other components are densely arranged around the LED device, which is not conducive to the heat dissipation of the LED; in addition , Use epoxy or silicone material as the shell to encapsulate the LED device, the light transmission is not ver...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S8/10F21V19/00F21V29/50F21V5/00F21W101/02F21Y101/02F21V29/503F21W107/10F21Y115/10
Inventor 杨晓锋
Owner SHANGHAI SEEYAO ELECTRONICS CO LTD