Thermal paste smearing apparatus

Abstract

A thermal paste smearing apparatus is used for smearing a thermal paste on the thermal contact surface of a radiator, and comprises a platform arranged on the radiator, a support column arranged on the platform, a support fixed on the support column, a baseboard arranged at the bottom of the support, a top board arranged at the top of the support, and a hollow thermal paste conduit having an upper opening and a lower opening, the baseboard is provided with a smearing hole, the top board is provided with a through hole, the thermal paste conduit penetrates through the through hole, the lower opening of thermal paste conduit aligns and is close to the smearing hole, and the lower opening of the thermal paste conduit is provided with smearing sheets. When the thermal paste is smeared, the radiator is disposed on the platform, the thermal contact surface of the radiator upward abuts against the smearing hole, the thermal paste is filled from the upper opening of the thermal paste conduit, the thermal paste conduit rotates around the central axis of the thermal paste conduit, and the smearing sheets rotate with the thermal paste conduit to uniformly smear the thermal paste on the thermal contact surface of the radiator.

Description

technical field [0001] The invention relates to a heat dissipation paste applicator. Background technique [0002] It is necessary to apply a layer of thermal paste between electronic components (such as CPU) and the heat sink to make the heat sink and the electronic components fully contact and improve the heat dissipation efficiency. In the traditional manual application method, due to the difficulty in controlling the amount and thickness of the heat dissipation paste, it is difficult to apply the heat dissipation paste evenly on the contact surface of the radiator and the electronic components, and the application efficiency and quality of the heat dissipation paste are relatively low. The quality of the coating will directly affect the working temperature of the electronic components, thereby affecting the performance and stability of the electronic components. In addition, in the mass assembly production of the factory, due to the difference of operators and their ope...

AI Technical Summary

Problems solved by technology

In the traditional manual application method, due to the difficulty in controlling the amount and thickness of the heat dissipation paste, it is difficult to apply the heat dissipation paste evenly on the contact surface between the heat sink and the electronic components. The application efficiency and quality of the heat dissipation paste are relatively low, and the heat dissipation paste The coating quality will directly affect the working temperature of electronic components, and then affect the performance and stability of electronic components

In addition, in the batch assembly production of the factory, due to the different operators and their operating levels, the quality of applying thermal paste by hand will also vary, which will affect the standardization of the factory.

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