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Ball grid array (BGA) plant bead furnace

A bead planting furnace and heating plate technology, applied in electric heating devices, auxiliary devices, metal processing, etc., can solve the problems of low efficiency of disposable filter layer and good cleaning effect, achieve stable and reliable humidity control, good cleaning effect, and eliminate damage effect

Inactive Publication Date: 2013-06-26
SHAANXI ZIZHU ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The structure is simple, the design is reasonable, and the use and operation are convenient, which can effectively solve the problem of low efficiency in the prior art of using shutdown cleaning or the use of a disposable filter layer, and at the same time has a good cleaning effect

Method used

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  • Ball grid array (BGA) plant bead furnace
  • Ball grid array (BGA) plant bead furnace
  • Ball grid array (BGA) plant bead furnace

Examples

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Embodiment Construction

[0022] Such as Figure 1 to Figure 3 As shown, the present invention includes a box body 1 and a heating plate 2, a cooling plate 3 and an operation interface 6 arranged on the box body 1. A heating part and a cooling part are arranged inside the box body 1, and the heating part is used for The heating tube 9 for heating the heating plate 2 and the thermocouple 10 used to detect the current temperature of the heating plate 2 in real time and transmit the detected temperature to the controller 5 are composed of two parts. The heat sink 11 and the fan 12 are gone; the thermocouple 10 and the fan 12 are all connected to the controller 5 and controlled by the controller 5; the controller 5 is also connected and arranged on the operation interface 6 and used for real-time display heating A temperature display unit 6-1 for the temperature on the board 2 and an alarm unit 6-2 for alarming after the bead welding is completed.

[0023] In this embodiment, the alarm unit 6-2 is an audi...

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Abstract

The invention discloses a ball grid array (BGA) plant bead furnace. The BGA plant bead furnace comprises a box body, a heating plate, a cooling plate and an operation interface, wherein the heating plate, the cooling plate and the operation interface are arranged on the box body, a heating portion and a cooling portion are arranged inside the box body, the heating portion comprises a heating pipe used for heating the heating plate and a thermocouple used for detecting current temperature of the heating plate in real time and transmitting the detected temperature to a controller, and the cooling portion comprises cooling fins for dissipating heat quickly when cooling is needed and a fan; the thermocouple and the fan are both connected with the controller and are controlled through the controller; the controller is further connected with a temperature display unit used for displaying the temperature of the heating plate in real time and an alarming unit used for alarming after welding of plant beads is finished, wherein the temperature display unit and the alarming unit are arranged on the operation interface. The BGA plant bead furnace is simple in structure, convenient to distribute and arrange, simple to use and operate, and capable of effectively achieving the process of welding of the plant beads of a BGA chip.

Description

technical field [0001] The invention belongs to the technical field of BGA rework station control systems, and in particular relates to a BGA bead planting furnace. Background technique [0002] With the increasingly powerful functions of technological products, the number of pins in IC packages is increasing, and the requirement for reducing the size of ICs has become more urgent, and the requirements for automation and yield are also increasing. Traditional surface packaging technology can no longer meet these requirements, and ball grid array packaging BGA technology is becoming the mainstream of new IC packaging. BGA is a new packaging form of surface-mounted ICs. Its leads are distributed on the bottom of the package in a matrix. Although the number of I / O pins increases, the pin spacing does not decrease, and it is much larger than traditional packaging. Thus, the assembly yield is improved. Therefore, BGA technology has gradually become the best choice for large-sca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/04B23K3/08
Inventor 刘宇
Owner SHAANXI ZIZHU ELECTRON
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