Detection device and detection method

Abstract

The invention discloses a detection device and a detection method. The detection device comprises a light source, a light filter, at least one screen, a spectroscope and an image acquisition unit, the light source provides a light ray, the light filter is arranged in front of the light source and used for filtering the light ray, the screens are arranged in front of the light filter and are provided with a plurality of meshes in regular arrangement, the filtered light ray passes the meshes to form reticular light, the spectroscope is arranged in front of the screens obliquely and is used for reflecting and projecting the reticular light to a surface to be detected, the image acquisition unit is arranged above the spectroscope and is used for acquiring a reflected image which is reflected by the surface to be detected, passes the spectroscope and is used for judging whether a defect is on the surface to be detected or not.

Description

technical field [0001] The present invention relates to a detection device and method, in particular to a detection device and method of a semiconductor component. Background technique [0002] Nowadays, in order to meet the needs of various consumer electronics products, the semiconductor packaging industry has gradually developed various types of packaging designs, among which flip chips are often used in various packaging structures and are arranged in Package substrate (substrate) or lead frame (leadframe). Generally speaking, the manufacturing process of the flip-chip packaging structure is roughly as follows: firstly, a wafer is made, and bumps are made on its active surface; then, the wafer is placed upside down on another carrier board and tape Make the back of the wafer face up, cut the back of the wafer and separate it into several chips; after that, use the vacuum suction head to remove the chips one by one, and place them on a carrier board, such as a package su...

AI Technical Summary

Problems solved by technology

However, when the size of surface defects such as cracks or cracks on the back of the chip is too small, the operator cannot directly detect these tiny surface defects with the naked eye through a low-magnification optical microscope

The result of the above-mentioned low detection accuracy will lead to flip chips with surface defects that may accidentally pass the test and be mixed into a large number of finished products, thus affecting the service life and reliability of the product

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