Circuit board manufacturing method and circuit board manufactured by same
A manufacturing method and circuit board technology, which are applied in the directions of printed circuit components, secondary processing of printed circuits, and non-metallic protective layer coating, etc., can solve the problems of complex detection methods and equipment, low circuit board efficiency, and long test time.
Active Publication Date: 2013-06-26
泰和电路科技(惠州)有限公司 +1
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Problems solved by technology
This type of detection method has complex equipment and long test time, resulting in low efficiency in circuit board shape detection and circuit board production
Method used
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[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0028] like figure 1 As shown, it is a flow chart of the steps of the circuit board manufacturing method of an embodiment, including the following steps:
[0029] Step S101 , printing solder resist ink on a circuit board formed with lines and pads.
[0030] The pads on the circuit board are used for welding / connecting electronic components, and the lines are used for the electrical connection between the pads. The impact is usually to cover a layer of...
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The invention discloses a circuit board manufacturing method. The circuit board manufacturing method includes: printing solder resist ink on a circuit board formed with circuits and a solder pad; attaching a solder resist exposure film on the solder resist ink on the circuit board, wherein the solder resist exposure film is provided with a solder pad window and an outline winnowing line, the solder pad window corresponds to the solder pad on the circuit board, and the outline windowing line corresponds to the outline of the to-be-shaped-circuit-board; treating the circuit board attached with the solder resist exposure film via exposing; subjecting the exposed circuit board to developing and corroding via corresponding solution so as to remove the solder resist ink corresponding to the solder pad window and the outline windowing line and form a solder resist layer on the parts; and cutting to shape the developed and corroded circuit board. Via above circuit board manufacturing method, after the outline of the circuit board is completely processed, a worker can judge whether the outline of the circuit board is qualified or not via detecting whether trails at edges of the outline of the circuit board are complete or not, the detecting method is quick, and circuit board detecting efficiency and circuit board manufacturing efficiency are improved.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a circuit board which is convenient for shape detection and a circuit board manufactured by the method. Background technique [0002] A circuit board (PCB) refers to a board that is printed on an insulating substrate according to a predetermined design and provides conductive patterns between components. The circuit board is one of the important electronic components, the support of electronic components, and the provider of electrical connections for electronic components. [0003] The general circuit board production process includes cutting, drilling, copper sinking, full board plating, outer layer dry film, graphic plating, etching, solder mask, characters, tin spraying, forming, electrical testing, FQC, FQA, packaging, etc. [0004] The shape of the circuit board is usually processed by a CNC milling machine. Due to factors such as pro...
Claims
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IPC IPC(8): H05K3/28H05K1/02
Inventor 何剑侠
Owner 泰和电路科技(惠州)有限公司