Ink composition and application for same, as well as product with selectively-metallized surface and preparation method for same

An ink composition and a technology for the composition, applied in the application, ink, metal material coating process and other directions, can solve the problems of increasing process complexity, increasing operating costs, and complicating processing processes, achieving low prices and reducing production costs. , the effect of simple process

Active Publication Date: 2013-07-03
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Although the methods disclosed in CN101747650A, CN102071421A, CN102071423A, CN102071411A, CN102071424A and CN102071412A can selectively metallize the surface of an insulating substrate such as plastic, and then form a signal conduction path on the surface of the insulating substrate; however, the above The disadvantage of the method is that presetting the electroless plating catalyst in the base material not only complicates the processing of the base material, but also makes the above-mentioned method have strong raw material limitations. In addition, before plating the metal, it is necessary to use a laser to insulate the substrate. The insulating substrate is etched to expose the electroless plating catalyst pre-set in the insulating substrate, which increases the complexity of the process and increases the operating cost

Method used

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  • Ink composition and application for same, as well as product with selectively-metallized surface and preparation method for same

Examples

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preparation example Construction

[0044] The preparation method of the ink composition according to the present invention is not particularly limited, as long as the titanium oxide represented by formula I can be uniformly mixed with the binder and optional solvents and additives. For example, the ink composition according to the present invention can be obtained by uniformly mixing the titanium oxide represented by formula I with the binder and optional solvents and additives in a mixer (such as a planetary ball mill). The methods and conditions for uniformly mixing the components in a mixer are well known in the art and will not be repeated here.

[0045] The ink composition according to the present invention can be applied on the surface of an insulating (i.e., non-conductive) substrate, and electroless plating can be performed directly on the surface of the insulating substrate with the ink layer without laser etching. or electroplating to selectively metallize the surface of the insulating substrate, ther...

Embodiment 1

[0086] (1) Titanium dioxide (commercially purchased from Aladdin Reagent Company, with an average particle size of 60nm) is loaded into the middle section of the porcelain boat, the boat is put into the reaction tube and placed in the high temperature section of the muffle furnace, and the reaction tube is placed on both sides Plug the end with a rubber stopper and cool it with dripping water, replace the air in the tube with ammonia gas, and check the sealing condition of the reaction device with pH test paper at the same time, turn on the power after no ammonia gas leaks, and keep the flow rate of ammonia gas at 4cm 3 / s. The muffle furnace was raised to 780°C and held at this temperature for 4 hours, then the boat was cooled to 100°C in an ammonia atmosphere. Turn off the ammonia gas, take out the boat, put it into a desiccator to cool to room temperature, and obtain the titanium oxide shown in formula I. The prepared titanium oxide is subjected to high-speed ball milling to...

Embodiment 2

[0092] The same method as in Example 1 is used to prepare the ink composition and selectively metallize the substrate, the difference is that in step (3), after mixing the ink composition prepared in step (2) with the epoxy resin binder , the resulting mixture was applied on the surface of a polyimide substrate by spraying, dried at a temperature of 100° C. for 2 hours, and then cured at a temperature of 120° C. for 1.5 hours. Wherein, in the epoxy resin binder, the epoxy resin is a bisphenol A type epoxy resin, and the epoxy value is 0.58mol / 100g; the curing agent is phthalic anhydride; The ink composition, the consumption of epoxy resin is 10 grams, and the consumption of curing agent is 7.2 grams.

[0093] It was determined that the thickness of the coating was 20 microns, the coating rate was 3.1 μm / h, and the adhesion of the metal layer formed on the surface of the substrate was 4B.

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Abstract

The invention provides an ink composition and an application for the same. The composition contains titanium oxides shown in formula I: TiO2-sigma and a connecting material, wherein relative to 100 parts by weight of the titanium oxides shown in formula I, the content of the connecting material is 1-30 parts by weight. The invention further provides a product with a selectively-metallized surface and a preparation method for the same. The method comprises the following steps of: applying the ink composition on the surface needing to be metallized of an insulating base material, so as to form an ink layer; and plating one or more than two metal layers on the surface of the insulating base material with the ink layer by virtue of electroplating or chemical plating. Compared with the generally-used conductive precious metals, metal compounds in the ink composition provided by the invention are low in price, wide in raw material source, and capable of remarkably reducing production cost for signal components. The method for selectively metallizing the surface of the insulating base material provided by the invention is strong in universality, capable of being applied to insulating base materials with various sources, and simple and convenient in process.

Description

technical field [0001] The invention relates to an ink composition and its application, and also relates to a surface selective metallized product and a preparation method thereof. Background technique [0002] A metal layer is formed on the surface of an insulating substrate such as plastic to act as a path for electromagnetic signal transmission, and is widely used in the fields of automobiles, computers, and communications. Various methods can be used to form a metal layer on the surface of an insulating substrate such as plastic. For example, the applicant's patent applications CN101747650A, CN102071421A, CN102071423A, CN102071411A, CN102071424A and CN102071412A disclose that the electroless plating catalyst can be preset in the plastic substrate during the preparation of the insulating substrate. First adopt the method such as laser etching to remove the substrate in the selected area of ​​the surface of the plastic substrate, expose the electroless plating catalyst in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/02C09D11/14C09D11/10C25D5/02C23C18/16C09D11/52
Inventor 苗伟峰
Owner BYD CO LTD
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