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Method for preparing high-heat-conductivity conductive adhesive containing graphene

A technology of graphene and conductive adhesive, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of insufficient electrical conductivity and thermal conductivity, and achieve the effect of improving thermal conductivity and satisfying lead-free reflow

Active Publication Date: 2014-08-20
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the lack of electrical conductivity and thermal conductivity of the conductive adhesive used in high-power devices, the invention provides a method capable of preparing conductive adhesive with high thermal conductivity by introducing graphene nanomaterials, so as to meet the needs of high-power devices

Method used

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  • Method for preparing high-heat-conductivity conductive adhesive containing graphene
  • Method for preparing high-heat-conductivity conductive adhesive containing graphene
  • Method for preparing high-heat-conductivity conductive adhesive containing graphene

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] At normal temperature, according to each component specified in Example 1 in Table 1, bisphenol A type epoxy resin neopentyl glycol glycidyl ether and 1,4-cyclohexanediol glycidyl ether were mixed for 10 minutes to uniform, then add 2-undecylimidazole and γ-aminopropyltriethoxysilane, mix at room temperature for 15 minutes to form a homogeneous mixture, and then grind with a three-roll machine, add flake silver powder, mix at room temperature at low speed for 60 The conductive adhesive can be prepared in a few minutes.

Embodiment 2

[0030] At room temperature, according to the components specified in Example 2 in Table 1, bisphenol A type, bisphenol F type epoxy resin and 1,4-butanediol glycidyl ether were mixed for 10 minutes until uniform, and then added 2-Ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, γ-(2,3-epoxypropoxy)propyltrimethoxysilane and γ-methacryloxypropyl Base trimethoxysilane, mix at room temperature for 10 minutes to form a homogeneous mixture, and then grind with a three-roller machine, add flake silver powder, and mix at room temperature for 60 minutes at a low speed to obtain a conductive adhesive.

Embodiment 3

[0032] Formulate each component according to embodiment 3 in table 1, bisphenol A type, bisphenol F type epoxy resin and 1,4-cyclohexanediol glycidyl ether, polyethylene glycol diglycidyl ether were mixed for 20 minutes until uniform, then graphene, micron silver powder, γ-aminopropyltriethoxysilane, and hexamethylenediaminomethyltrimethoxysilane are added to the epoxy resin mixture, mixed at room temperature for 10 minutes to form a uniform mixture, and then After three-roll milling, 1-cyanoethyl-2-ethyl-4-methylimidazole and 2-phenyl-4-methylimidazole were added at 40 o C under vacuum for 60 minutes to prepare the conductive adhesive of the present invention.

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Abstract

The invention provides a method for preparing high-heat-conductivity conductive adhesive containing graphene. The method comprises the steps of (1) functionalizing surface of graphene, namely adding graphene to acetone solution of an organic matter containing a conjugate ring, and strongly ultrasonically shaking for 6-48 hours at 40-100 DEG C to form non-covalent modified graphene; (2) mixing epoxy resin with an epoxy diluent for 3-30 minutes at room temperature to obtain a mixture of epoxy resin and the epoxy diluent, and sequentially adding metal powder and a coupling agent to the mixture; (3) adding the non-covalent modified graphene prepared in the step (1) to the mixture in the step (2); and (4) adding a curing agent to the mixture in the step (3) to prepare the even conductive adhesive. The method has the advantages that dispersing and enhancing interface joint in an epoxy system are facilitated by functionalizing the surface of graphene by a non-covalent bond; and then graphene is mixed with metal powder to obtain the high-heat-conductivity conductive adhesive. The high-heat-conductivity conductive adhesive has the application prospect in a high-power apparatus.

Description

technical field [0001] The invention relates to a preparation method of conductive glue containing graphene, which is especially suitable for the preparation method of high thermal conductivity conductive glue. Background technique [0002] Conductive adhesive is an adhesive with certain electrical and thermal conductivity after curing. It is usually composed of matrix resin, conductive filler and additives. The resin matrix mainly plays a bonding role, and the filler is used to form a conductive path. The matrix resin is mainly thermosetting epoxy resin, silicone resin, polyimide resin, phenolic resin, polyurethane, acrylic resin, etc.; the conductive filler can be gold, silver, copper, aluminum, zinc, iron, nickel powder and plating Silver Metal Powder etc. [0003] Conductive adhesives are mainly used as interconnect materials in the fields of microelectronic packaging and LED packaging, which play the role of heat conduction and electrical conduction. However, with the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/00C09J9/02C09J9/00C09C1/46C09C3/08
Inventor 高宏胡国俊邹嘉佳
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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