A Method for Measuring Compensation Effect of Mirror Shape
A compensation effect, mirror surface technology, applied in measuring devices, photoengraving process of pattern surface, originals used for optomechanical processing, etc. Simple, avoids the effect of unnecessary error terms
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specific Embodiment 1
[0027] see figure 1 As shown, the lithography machine used in the present invention includes an illumination system 1 , a mask table 3 carrying a mask 2 , a projection objective lens 4 for mask imaging, and a substrate table 6 carrying a substrate 5 . A first strip mirror 8 is attached to the side of the mask table 3, a second strip mirror 10 is attached to the side of the substrate table 6, the first interferometer 7 controls the movement of the mask table 3, and the second interferometer 9 controls the substrate table 6 moves, and the mask alignment system 11 and the substrate alignment system 12 are located on the substrate table 6 . The first interferometer control system 7 makes the interferometer beam reflected by the strip mirror 8 to control the horizontal (x, y, Rz) and vertical (z, Rx, Ry) movements of the mask table 3, and the second The interferometer control system 9 makes the interferometer beam reflected by the strip mirror 10 to control the horizontal (x, y, R...
specific Embodiment 2
[0033] The structure of the lithography machine system used in this embodiment is the same as that of Embodiment 1. This embodiment can verify the X-direction mirror shape compensation effect on the substrate table. The specific implementation steps are as follows:
[0034] 1) Upload the substrate with a test mark such as Figure 5 As shown, the test mark includes several sub-marks, the sub-marks are arranged in a row along the X direction on the substrate, the position Y of the sub-marks is the same, and the interval between the sub-marks is preferably 1 mm. The type of sub-marks is the same as the alignment mark of the substrate alignment system 11 match;
[0035] 2) The second interferometer 9 controls the movement of the substrate table 6 along the X direction (preferably Y=0), so that each sub-mark of the test mark on the substrate is respectively located under the optical axis of the substrate alignment system, and the substrate alignment system 12 performs alignment res...
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