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Modeling and parameter extracting method of gold wire interconnecting structure

A technology of gold wire interconnection and parameter extraction, which is applied in electrical digital data processing, special data processing applications, instruments, etc. It can solve the problem of not considering the influence of gold wire interconnection circuit, inconvenient quantitative analysis of process errors, and the guiding significance of process control. It is not a big problem, and achieves the effect of easy process tolerance, easy analysis, and clear physical meaning

Inactive Publication Date: 2013-07-10
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the current modeling and parameter extraction methods do not consider the influence of the position of the bonding point of the gold wire on the gold wire interconnection circuit, which has little guiding significance for process control and is not convenient for quantitative analysis of the impact of process errors

Method used

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  • Modeling and parameter extracting method of gold wire interconnecting structure
  • Modeling and parameter extracting method of gold wire interconnecting structure
  • Modeling and parameter extracting method of gold wire interconnecting structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Example 1 Modeling and Parameter Extraction of a Single Gold Wire Interconnection Structure

[0028] like figure 1 , figure 2 Shown are the circuit structures of the a-model (1a) and the b-model (1b) of the single-gold interconnect structure.

[0029] The parameters of resistance R and inductance L are extracted according to the physical properties of the impedance and self-inductance of the gold wire, which are specifically the functions of the resistivity ρ of the gold wire material, the skin depth δ of the gold wire, the diameter d of the gold wire, and the length l of the gold wire :

[0030] R = 4 ρl π d 2 cosh [ 0.04 l ...

Embodiment 2

[0056] Example 2 Modeling and parameter extraction of two gold wire interconnection structures

[0057] like image 3 , Figure 4 Shown are the circuit structures of the a-model (2a) of the two-gold interconnect structure and the b-model (2b) of the two-gold interconnect structure.

[0058] The parameters of resistance R and inductance L are extracted according to the physical properties of the impedance and self-inductance of the gold wire, which are specifically the functions of the resistivity ρ of the gold wire material, the skin depth δ of the gold wire, the diameter d of the gold wire, and the length l of the gold wire :

[0059] R = 4 ρl π d 2 cosh [ ...

Embodiment 3 3

[0089] Embodiment 3 Modeling and parameter extraction of interconnection structure with more than three gold wires

[0090] like Figure 5 , Image 6 Shown are the circuit structures of the a-model (3a) of the interconnection structure with more than three gold wires and the b-model (3b) of the interconnection structure of more than three gold wires.

[0091] The parameters of resistance R and inductance L are extracted according to the physical properties of the impedance and self-inductance of the gold wire, which are specifically the functions of the resistivity ρ of the gold wire material, the skin depth δ of the gold wire, the diameter d of the gold wire, and the length l of the gold wire :

[0092] R = 4 ρl π d 2 ...

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Abstract

The invention discloses a modeling and parameter extracting method of a gold wire interconnecting structure. The gold wire interconnecting structure comprises a gold wire model, a microstrip line notch circuit model, a left short transmission line model and a right transmission line model. A gold wire bonding point is disposed on the gold wire model. The microstrip line notch circuit model is provided with a microstrip line notch. Short transmission lines serve as transmission lines between the gold wire bonding point and the microstrip line notch. The left short transmission line model, the microstrip line notch circuit model and the right short transmission line model are sequentially serially connected and then parallelly connected with the gold wire model. Parameters of the short transmission line models are functions of the distance c from the gold wire bonding point to the microstrip line notch. By the modeling and parameter extracting method, researches can be performed to the position of the gold wire bonding point, influence of process error on gold wire interconnecting characteristics can be analyzed quantitatively, process tolerance analyzing is facilitated, statistical-law deduction can be performed to the position of the gold wire bonding point, and guidance can be provided for process control.

Description

technical field [0001] The invention relates to a modeling and parameter extraction method of a gold wire interconnection structure. Background technique [0002] In the design of hybrid microwave circuits, the interconnection of multi-chip components often requires bonding gold wires to interconnect structures such as microwave monolithic integrated circuit (MMIC) chips and microwave circuits. The bonding method is divided into spherical bonding and wedge bonding. The arch height, span, bonding point position and number of gold wires of gold wire bonding interconnection have a great influence on the interconnection of microwave multi-chip modules. [0003] The model extraction of bonded gold wire interconnection is one of the necessary prerequisites for its successful application. Only when the model parameters of the interconnection are accurately obtained can the corresponding matching and compensation network be comprehensively designed to achieve the overall performanc...

Claims

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Application Information

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IPC IPC(8): G06F17/50H01L21/768
Inventor 殷晓星王磊赵洪新
Owner SOUTHEAST UNIV
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