Etching device

Abstract

An etching device is provided with an etching assembly, a conveying assembly and a carrier assembly. The etching assembly is provided with an etching cavity, an upper cover plate and a lifting device. The upper cover plate is arranged on the top surface of the etching cavity in a reversible mode and the is provided with an electrode guide-in device, two air hole plates and a shading plate. The conveying assembly is arranged in the etching assembly and the inside of the etching cavity is provided with a plurality of rotating shafts in the etching cavity at intervals. The carrier assembly is arranged on the conveying assembly and is provided with a plurality of carrier discs, all the carrier discs are attached to rollers of the conveying assembly, the top surface of the carrier discs is provided with a pole plate, and two bearing holes arranged at intervals and respectively corresponding to two punched holes of the shading plate are formed on the pole plate in a penetrating mode. The etching device saves the cost, shortens the time of the production process and improves the yield.

Description

technical field [0001] The invention relates to an etching device, especially an etching device. Background technique [0002] Etching is a technology that removes materials through chemical reaction or physical impact. Existing etching technologies can be roughly divided into two types: wet etching and dry etching. Wet etching is performed through chemical solutions. Chemical reaction to achieve the etching effect, while dry etching is through a kind of plasma etching. Plasma etching may be the physical effect of ions in the plasma hitting the wafer surface or it may be the active free radicals in the plasma and the wafer surface. The chemical reaction between atoms may also be the combination of the two. With the development of science and technology, etching technology has been widely used in aviation, machinery, chemical and semiconductor manufacturing processes; [0003] The configuration of the etching machine 80 currently used in the industry is as follows: Figure 8...

AI Technical Summary

Problems solved by technology

[0004] However, although the existing etching machine 80 can be moved, positioned and etched by the robot arm 81, it takes a lot of time for the robot arm 81 to move between the chambers, and the robot arm 81 will be damaged after a long period of use. It is easy to affect the accuracy of its operation due to abrasion or abrasion, so that the wafer 90 may fall and be damaged during the moving process, and there is room for improvement

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