Method for processing FPC (Flexible Printed Circuit) blind hole
A processing method, blind hole technology, applied in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve problems such as microcracks on the outer edge of the hole bottom, bottom copper separation, bottom copper damage, etc., to improve the quality of blind hole processing , flat bottom, good quality effect
Active Publication Date: 2013-07-24
KUNSHAN THETA MICRO
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Problems solved by technology
In the FPC industry, holes are usually divided into through holes, blind holes, and buried holes; the common quality defects of existing laser technology drilling include bottom copper damage, microcracks on the outer edge of the bottom of the hole, bottom copper separation, and hole overhang. Copper and other issues
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Embodiment Construction
[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0028] see figure 1 , according to a kind of FPC blind hole processing method of the present invention, described method comprises the steps:
[0029] Step S0. Determine the size of the outer circle of the concentric circle according to the size of the blind hole required by the customer: subtract the laser spot compensation value from the required aperture size; determine the spacing of the concentric circles according to the size of the laser spot on the material, and the spacing setting range: 0.1-1 Spot size. Preferably, the distan...
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The invention discloses a method for processing a FPC (Flexible Printed Circuit) blind hole. The method comprises the following steps of step S1, equally dividing a plurality of concentric circles into two parts along circle dots; step S2, misplacing the two parts of concentric arcs, and connecting the concentric arcs to obtain misplaced concentric circles; step S3, completing helix, using line sections and curves to connect in the inner parts of semi-circles, and finishing outer rings to be round; and step S4, combining polylines of a whole pattern as an integer. According to the method for processing the FPC blind hole through a spiral filling way provided by the invention, processing speed can be effectively improved, and the quality of the processed blind hole is good, so that the blind hole processing reaches effects of smooth bottom and good hole pattern roundness, and production requirements are accorded with; and on the basis that the processing speed of the blind hole is guaranteed, the quality of the processed blind hole can be improved.
Description
[0001] technical field [0002] The invention belongs to the technical field of laser processing, and relates to a blind hole processing method, in particular to a FPC blind hole processing method. [0003] Background technique [0004] As a new type of thermal cutting technology, laser cutting has the advantages of fast cutting speed, high production efficiency, good cutting surface quality, small heat-affected zone and environmental protection. It has become one of the main sheet metal processing methods and has been widely used. application. [0005] Flexible printed circuit board FPC (Flexible Printed Circuit Board) is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have. For example, it can be bent, wound, and folded from the mountain, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so ...
Claims
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IPC IPC(8): B23K26/38B23K101/42B23K26/386
Inventor 魏志凌宁军蔡猛
Owner KUNSHAN THETA MICRO