Multi-level partition cooling system
A heat dissipation system and zoning technology, which is applied in cooling/ventilation/heating transformation, temperature control using electric methods, etc., can solve the problems of increased cost and technical requirements, inability to adjust the degree of heat dissipation, and insulation to be verified, etc., to achieve Ease of maintenance, space reduction, and energy saving effects
Inactive Publication Date: 2016-04-20
SHANGHAI DIANJI UNIV
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Problems solved by technology
The above-mentioned prior art has the following defects: the equipment is connected to the exposed parts such as semiconductors, and the insulation performance needs to be verified. At the same time, due to the insulating resin separating the lead part and the insulating partition part of the component holding part, the resin will be damaged if the temperature is too high during operation. Spontaneous combustion may occur, fans are no longer used for heat dissipation, cost and technical requirements increase, and simple partition heat dissipation cannot achieve integrated heat dissipation adjustment
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[0014] Below, combined with figure 1 with figure 2 The present invention is described in further detail. The present embodiment is implemented under the premise of the technical solution of the present invention, and detailed implementation and specific operation process are provided, but the protection scope of the present invention is not limited to the following examples.
[0015] Please refer to figure 1 , the present invention proposes a multi-stage partition heat dissipation system, which is used to dissipate heat for electronic equipment 10. In this embodiment, the heat dissipation area of electronic equipment 10 is divided into five areas, wherein the first heat dissipation area 11, the second heat dissipation area The heat dissipation area 12 , the third heat dissipation area 13 and the fourth heat dissipation area 14 are located around the fifth heat dissipation area 15 .
[0016] The first temperature sensor and the first fan 21 driven by the first motor are ar...
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The invention provides a multi-stage zoning cooling system which is used for cooling electronic equipment, and comprises a plurality of temperature sensors and a plurality of fans, wherein each sensor and each fan are connected with a control chip; a cooling zone of the electronic equipment is divided into a plurality of areas; one temperature sensor and one fan are arranged above each area; and the control chip controls rotating speeds of the fans. The multi-stage zoning cooling system achieves zoning cooling of the equipment, achieves multi-stage zoning cooling of the rotating speeds of the multi-stage fans, can adjust automatically according to an actual temperature, occupies a small space, and is energy-saving and convenient to maintain as far as possible on the basis of ensuring equipment cooling.
Description
technical field [0001] The invention relates to a cooling system for electronic equipment, in particular to a multi-stage partition cooling system for large-area electronic integrated components. Background technique [0002] With the development of electronic technology, electronic equipment is developing by leaps and bounds, electronic equipment is developing towards miniaturization, electronic components are getting smaller and smaller, and the degree of integration of electronic boards is getting higher and higher. The area is developing, but this also means that the heat generated per unit area is getting higher and higher during the use of electronic equipment, followed by its heat dissipation problem, and because of the arrangement of the original components of electronic boards, electronic screens, etc. Due to different working conditions, there is a big difference in temperature in different areas. Even the heat generated by each component unit in the same electroni...
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IPC IPC(8): H05K7/20G05D23/19
Inventor 孙晨凯周志勇
Owner SHANGHAI DIANJI UNIV