DRAM (dynamic random access memory) double-chip stacking and packaging structure and packaging technology

Abstract

The invention discloses a DRAM (dynamic random access memory) double-chip stacking and packaging structure and packaging technology. According to the invention, an intermediary substrate is used for connecting a first chip and a second chip onto the substrate; restriction on a transmission line caused by the intermediary substrate is reduced; problems brought by the long-distance transmission of data are eliminated; and the packaging electrical properties are improved. The scheme is characterized in that only a bonding wire between the intermediary substrate and the substrate exists, thus being different from the characteristic of a gold wire slack above the second chip in the traditional DRAM package, the bonding wire slack is hedged by the second chip on the normal of the substrate, and the integral height of a packaging body is reduced. Due to the fact that the packaging body is only routed once, the gold wire use amount is reduced, and therefore the packaging cost is saved.

Description

technical field [0001] The invention relates to a DRAM double-chip stacking packaging structure and packaging technology. DRAM is an abbreviation of Dynamic Random Access Memory, that is, a dynamic random access memory. Background technique [0002] The explosive growth of information in modern society is inseparable from the rapid development and popularization of electronic products - especially consumer electronic products. Various electronic products have brought convenience to people's life, study and work. [0003] With the continuous development of science and technology and the improvement of consumers' requirements for electronic products, the functions of mobile phones and other consumer electronics continue to diversify, their performance and speed continue to increase, and the size is moving towards the trend of light, thin, short and small. To this end, integrated circuits use the following two methods to reduce the size and weight of products. The first is SOC ...

AI Technical Summary

Problems solved by technology

[0009] In order to improve the problems of high cost, large package thickness, poor reliability and poor electrical performance in the traditional DRAM double-chip stack package, the purpose of the present invention is to provide a DRAM double-chip stack package structure using less bonding wires, and provide A kind of encapsulation process of this encapsulation structure

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