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System and method for offloading IC units

A technology of assembly and shuttle table, applied in the field of systems and methods for removing IC units, capable of solving problems such as deformation of IC units

Inactive Publication Date: 2013-08-28
ROKKO VENTURES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with this process technology is that applying the axial force may cause deformation of the IC unit, preventing insertion of the IC unit into the tube
However, it is impractical to place and then remove the blocking obstacle to transfer the unit to the station

Method used

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  • System and method for offloading IC units
  • System and method for offloading IC units
  • System and method for offloading IC units

Examples

Experimental program
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Embodiment Construction

[0013] Figure 1A , Figure 1B , Figure 2A , Figure 2B and image 3 An embodiment of the present invention is shown whereby the shuttle table assembly 5 is movable from a first position to a second position. In the first position, the IC unit 30 is transported in the transport direction 35 to the receiving surface 20 on the shuttle table 10 . Each IC unit 30 is conveyed by a pick and place machine 25 having a vacuum engagement to engage the IC unit 30 which is then released to disengage the unit 30 .

[0014] The receiving surface 20 may or may not have a vacuum source to engage the unit. While a vacuum source may be required for shuttle tables according to the prior art, the introduction of the cover 15 makes a vacuum source unnecessary. However, it will be appreciated that in some applications a vacuum source may still be used with a shuttle assembly according to the present invention.

[0015] The shuttle table assembly 5 includes a swivel assembly 40 that includes ...

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PUM

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Abstract

A shuttle table assembly comprising a shuttle table for receiving a plurality of IC units at a first position and for offloading said units at a second position, said shuttle table movable from said first to second position; a cover assembly mounted to said shuttle table, the cover assembly having at least one cover movable from an open position to a closed position, said closed position covering said units on the shuttle table; wherein the cover assembly is coupled to a guide for closing the cover as the shuttle table moves from the first to the second position.

Description

technical field [0001] The present invention relates to processing singulated integrated circuit (IC) units. In particular, the invention relates to unloading said units from a handler. Background technique [0002] Integrated circuit units are formed in a substrate of several IC units, and the integrated circuit units are then diced into individual units ready for assembly into individual devices. [0003] Assembly of this component requires the transfer of batches of units to the manufacturer, which can be incorporated into the assembly process. This approach involves conveying integrated circuit units in containers, such as tubes, that can be mounted to assembly assembly devices for automated assembly. Accordingly, the processing assembly must include a method of loading cut units into a tube, such as having: a table for receiving said units; and a pusher towards the table. The upper row of cells applies an axial force, and the cells are then pushed into the tube. A p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67721H01L21/67333H01L21/50H01L21/67766H01L21/67769H01L21/67778
Inventor 杨海春张德春
Owner ROKKO VENTURES PTE LTD