System and method for offloading IC units
A technology of assembly and shuttle table, applied in the field of systems and methods for removing IC units, capable of solving problems such as deformation of IC units
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[0013] Figure 1A , Figure 1B , Figure 2A , Figure 2B and image 3 An embodiment of the present invention is shown whereby the shuttle table assembly 5 is movable from a first position to a second position. In the first position, the IC unit 30 is transported in the transport direction 35 to the receiving surface 20 on the shuttle table 10 . Each IC unit 30 is conveyed by a pick and place machine 25 having a vacuum engagement to engage the IC unit 30 which is then released to disengage the unit 30 .
[0014] The receiving surface 20 may or may not have a vacuum source to engage the unit. While a vacuum source may be required for shuttle tables according to the prior art, the introduction of the cover 15 makes a vacuum source unnecessary. However, it will be appreciated that in some applications a vacuum source may still be used with a shuttle assembly according to the present invention.
[0015] The shuttle table assembly 5 includes a swivel assembly 40 that includes ...
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