Special PC (Poly Carbonate) alloy material for thin-wall electronic product casing and preparation method of special PC alloy material

Abstract

The invention discloses a special PC (Poly Carbonate) alloy material for a thin-wall electronic product casing. The special PC alloy material consists of the following raw materials in parts by mass: 70-80 parts of PC, 7-15 parts of AS (acrylonitrile-styrene), 7-10 parts of liquid fire retardant RDP, 2-3 parts of impact modifier, 0-0.5 part of anti-drip agent, 2-5 parts of high glue powder, 0-3 parts of compatilizer and 0.1-0.2 part of antioxidant. A preparation method of the special PC (Poly Carbonate) alloy material for the thin-wall electronic product casing comprises the following steps of: (1) uniformly mixing other raw materials except the liquid fire retardant to obtain a mixture; and (2) adding the mixture obtained in the step (1) into an extruder for melt extrusion, and adding the liquid fire retardant into a feeding hole of the extruder by using a liquid metering pump when extrusion and granulation are carried out by using the extruder. According to the PC alloy, the melt flow rate is more than 27g / 10min; and in addition, as the fluidity is improved to V0 level within 0.8mm, the impact strength reaches 800J / m. The casing shell of the special PC alloy material can be reduced, and the purposes of saving materials and reducing cost are achieved.

Description

technical field [0001] The invention relates to a PC alloy special material used for thin-walled electronic product shells and a preparation method. Background technique [0002] The PC alloy materials developed on the market today basically have insufficient impact resistance (about 500J / m) and insufficient flow properties (melt index is about 17g / 10min), resulting in relatively thick products, because only Only when the corresponding thickness is reached can the high impact resistance be satisfied, and at the same time, because the fluidity is not good enough, the product will inevitably be prone to defects during injection molding, which will affect the molding production cycle. Contents of the invention [0003] The object of the present invention is to provide a PC alloy special material and a preparation method for thin-walled electronic product shells. [0004] The technical scheme that the present invention takes is: [0005] A PC alloy special material for thin-...

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Problems solved by technology

[0002] The PC alloy materials developed on the market today basically have insufficient impact resistance (about 500J / m) and insufficient flow properties (melt index is about 17g / 10min), resulting in relatively thick products, because only Reaching the corresponding thickness can meet the high impact resistance performance, and at the same time, because the fluidity is not good enough, the product will inevitably be prone to defects during injection molding, which will affect the molding production cycle

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