Method for processing circuit board and electroplating waste water through microwave, micro-electrolysis and oxidation technologies
A technology for electroplating wastewater and technical treatment, applied in chemical instruments and methods, multi-stage water/sewage treatment, water/sludge/sewage treatment, etc., can solve problems such as poor treatment effect of circuit boards and electroplating wastewater, and achieve construction The effect of fast and convenient installation, short process flow and reasonable process design
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Embodiment 1
[0032] A method for treating circuit boards and electroplating wastewater by microwave, micro-electrolysis and oxidation technology, comprising the following steps:
[0033] (1) In the micro-electrolytic container, iron-carbon fillers are loaded to form an iron-carbon electrolytic bed, and a sulfuric acid solution with a volume concentration of 5% is loaded into the electrolytic container to activate for 25 minutes;
[0034] (2) After the activation is completed, discharge the sulfuric acid solution in the electrolytic container, rinse the iron-carbon electrolytic bed with tap water, and drain the residual sulfuric acid;
[0035] (3) Regulate the pH of the circuit board and the electroplating waste water at 2.0 with sulfuric acid, then put the circuit board and the electroplating waste water from the water inlet of the electrolysis container, and open the aeration device in the electrolysis container simultaneously, and carry out micro-electrolysis reaction 60min;
[0036] (4) ...
Embodiment 2
[0045] A method for treating circuit boards and electroplating wastewater by microwave, micro-electrolysis and oxidation technology, comprising the following steps:
[0046] (1) In the micro-electrolysis container, iron-carbon fillers are loaded to form an iron-carbon electrolysis bed, and the sulfuric acid solution that the volume concentration is loaded into the electrolysis container is 15% to activate for 5 minutes;
[0047] (2) After the activation is completed, discharge the sulfuric acid solution in the electrolytic container, rinse the iron-carbon electrolytic bed with tap water, and drain the residual sulfuric acid;
[0048] (3) Regulate the pH of the circuit board and the electroplating waste water with hydrochloric acid at 4.0, then put the circuit board and the electroplating waste water from the water inlet of the electrolytic container, and simultaneously open the aeration device in the electrolytic container, and carry out micro-electrolysis reaction for 20 minu...
Embodiment 3
[0058] A method for treating circuit boards and electroplating wastewater by microwave, micro-electrolysis and oxidation technology, comprising the following steps:
[0059] (1) Iron-carbon fillers are loaded into the micro-electrolysis container to form an iron-carbon electrolysis bed, and the sulfuric acid solution that the volume concentration is loaded into the electrolysis container is 10% to activate 10min;
[0060] (2) After the activation is completed, discharge the sulfuric acid solution in the electrolytic container, rinse the iron-carbon electrolytic bed with tap water, and drain the residual sulfuric acid;
[0061] (3) Regulate the pH of the circuit board and the electroplating wastewater with hydrochloric acid at 4.5, then put the circuit board and the electroplating wastewater from the water inlet of the electrolysis container, and simultaneously open the aeration device in the electrolysis container to carry out the micro-electrolysis reaction for 40 minutes;
...
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