Binding equipment and binding method of chip

Abstract

An embodiment of the invention discloses binding equipment and a binding method of a chip, relates to the field of production technique of liquid crystal displaying equipment, and can solve the problem of warping after the chip and a substrate are bound. The binding equipment of the chip comprises a base platform and a pressure head, one surface, used for bearing a substrate, of the base platform has a first downward arc, one surface, in contact with the chip, of the pressure head has a second downward arc, and the base platform with the first arc is matched with the pressure head with the second arc.

Description

technical field [0001] The invention relates to the field of manufacturing technology of liquid crystal display devices, in particular to a chip binding device and method. Background technique [0002] In order to better reduce costs, the current small-size LCD products basically use the (Chip On Glass, COG for short) chip bonding process to drive the LCD panel. Specifically, after forming bumps on the bare chip, on the substrate Connect directly to the leads of the LCD screen. [0003] During the COG bonding process, when the main pressure is performed, the high-temperature indenter first contacts the chip, and the heat is conducted to the anisotropic conductive adhesive and the substrate through the chip. At this time, the temperature difference between the substrate and the platform is large, causing There is a difference in swell size between the two. After the anisotropic conductive adhesive is cured, the relative position between the chip and the substrate is fixed. ...

AI Technical Summary

Problems solved by technology

After the anisotropic conductive adhesive is cured, the relative position between the chip and the substrate is fixed. After the main pressure is finished, the chip and the substrate cool down, and the shrinkage of the chip is larger than that of the substrate, so that the two ends of the chip have a larger opposition to the substrate. stress, which causes chip and substrate warpage

The warpage of the chip and the substrate will lead to adverse consequences such as chip peeling, chip breakage, and uneven brightness and darkness of the display effect.

[0004] At present, low-temperature anisotropic conductive adhesive products are mainly used to solve the problem of chip and substrate warpage, but the product is currently expensive and the technology is immature

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