A packaging structure for LED AC drive high-voltage chips
A high-voltage chip, packaging structure technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as poor voltage resistance, difficult safety regulations and heat dissipation requirements, no packaging, etc., to improve heat dissipation efficiency and improve the effect of heat dissipation
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[0012] The present invention will be further described below in conjunction with the accompanying drawings.
[0013] Please refer to figure 1 and figure 2 , the present invention is used for the package structure of LED AC driving high-voltage chips, which includes a rectangular chip body 1, and the back of the chip body 1 is provided with a plurality of ultra-high voltage pins 2 (ie PIN), a plurality of high-voltage pins 3, a plurality of A low-voltage pin 4, an ultra-high-voltage pin 2 is arranged on the top of the back of the chip body 1, a high-voltage pin 3 is arranged on the left and right sides of the back of the chip body 1, and a low-voltage pin 4 is arranged on the bottom of the back of the chip body 1, and the ultra-high voltage pin 4 is arranged on the back of the chip body 1. The spacing between pins 2, the spacing between high-voltage pins 3, the spacing between ultra-high-voltage pins 2 and heat sink 5, and the spacing between high-voltage pins 3 and heat sink...
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