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A packaging structure for LED AC drive high-voltage chips

A high-voltage chip, packaging structure technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as poor voltage resistance, difficult safety regulations and heat dissipation requirements, no packaging, etc., to improve heat dissipation efficiency and improve the effect of heat dissipation

Active Publication Date: 2016-01-20
嘉善联睿电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally, the LED drive system used in LED lighting fixtures usually needs to use LED drive chips to drive LEDs. However, most of the existing LED drive chips are designed for low-voltage chips. This low-voltage drive chip has poor voltage resistance and poor heat dissipation.
Since the LED AC driver is a high-voltage direct drive, if the general-purpose package design is continued, the design will not meet the safety requirements, especially when the pins are more than 8, it is difficult to meet the safety and heat dissipation requirements, and there is no matching package.

Method used

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  • A packaging structure for LED AC drive high-voltage chips
  • A packaging structure for LED AC drive high-voltage chips

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Embodiment Construction

[0012] The present invention will be further described below in conjunction with the accompanying drawings.

[0013] Please refer to figure 1 and figure 2 , the present invention is used for the package structure of LED AC driving high-voltage chips, which includes a rectangular chip body 1, and the back of the chip body 1 is provided with a plurality of ultra-high voltage pins 2 (ie PIN), a plurality of high-voltage pins 3, a plurality of A low-voltage pin 4, an ultra-high-voltage pin 2 is arranged on the top of the back of the chip body 1, a high-voltage pin 3 is arranged on the left and right sides of the back of the chip body 1, and a low-voltage pin 4 is arranged on the bottom of the back of the chip body 1, and the ultra-high voltage pin 4 is arranged on the back of the chip body 1. The spacing between pins 2, the spacing between high-voltage pins 3, the spacing between ultra-high-voltage pins 2 and heat sink 5, and the spacing between high-voltage pins 3 and heat sink...

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Abstract

The invention discloses a packaging structure of an LED alternating-current driving high-voltage chip. The packaging structure comprises a rectangular chip body, a plurality of ultrahigh-voltage pins, a plurality of high-voltage pins and a plurality of low-voltage pins are arranged on the back of the chip body, pitches among the ultrahigh-voltage pins, among the high-voltage pins, among the ultrahigh-voltage pins and radiating fins and among the high-voltage pins and the radiating fins are larger than pitches among the low-voltage pins, namely that the pitches among the ultrahigh-voltage pins, among the high-voltage pins, among the ultrahigh-voltage pins and radiating fins and among the high-voltage pins and the radiating fins are large, so that the chip can meet requirements on voltage withstanding and safety. The radiating fins are attached on a substrate on the back of the chip body, so that the chip can quickly radiate via the radiating fins, and radiating efficiency and radiating effect are improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging structure for LED AC driving high-voltage chips. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a new generation of light source that uses semiconductor materials as the electro-optic conversion medium. It has the characteristics of energy saving, environmental protection, long life, and small size. It will soon replace energy-saving lamps and become mainstream lighting. With the implementation of the global ban on production and sales of incandescent lamps, LED lighting will face the opportunity to replace incandescent lamps, with a market size of hundreds of billions. [0003] Generally, the LED drive system used in LED lighting fixtures usually needs to use LED drive chips to drive the LEDs. However, most of the existing LED drive chips are low-voltage chip designs. Such low-voltage drive chips have poor voltage resistance ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/64
Inventor 齐良颉池从伟刘成军
Owner 嘉善联睿电子科技有限公司