A coaxial-suspension coplanar waveguide transfer device and microstrip soldering method
A coplanar waveguide and microstrip technology, applied in the microwave field, can solve the problems of difficult production operation and low pass rate of experiments
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Embodiment 1
[0027] Such as Figure 1-Figure 4 As shown, according to the characteristics of the suspended coplanar waveguide structure and the thinner 1.85mm coaxial inner conductor, first wrap the gold foil 8 on the input end and output end of the microstrip sheet 7, and wrap it from the front to the back of the microstrip sheet 7 The appropriate position, and thermocompression welding, then solder the microstrip 7 in the substrate cavity 4, and finally use the curved small thin copper tube 1 to connect the coaxial connector and the suspended coplanar waveguide, and tighten it through the outer conductor solid together.
[0028] Because the microstrip 7 is relatively thin, it is difficult to directly plate gold on the input and output ends of the microstrip 7, and the reliability is not good. Therefore, the input and output ends of the microstrip sheet 7 are wrapped with gold foil 8 from the front to the back, and hot-press welded, so that the difficulty can be reduced, the reliability ...
Embodiment 2
[0031] On the basis of the above examples, if Figure 1-Figure 4 As shown, the present invention provides an ultra-broadband high-performance coaxial-suspension coplanar waveguide transfer device, wherein, after the coaxial connector is connected to the suspension coplanar waveguide through a curved small thin copper tube 1, the external The conductor securely connects the coaxial connector, the curved small thin copper tube 1 and the suspended coplanar waveguide; the substrate cavity 4 is provided with a microstrip sheet 7 .
[0032] Further, the substrate cavity 4 is a circular copper cavity or a curved copper cavity.
[0033] Further, the symmetrical ends of the substrate chamber 4 are provided with microstrip placement slots 3 respectively, and the microstrip placement slots 3 are connected to the solder wire placement holes 2 .
[0034] Further, the input end and the output end of the microstrip sheet 7 are respectively wrapped with gold foil 8; the width of the gold foi...
Embodiment 3
[0037] On the basis of the above examples, if Figure 1-Figure 4 As shown, the present invention provides a method for soldering an ultra-broadband high-performance microstrip sheet, which is used for the soldering of the microstrip sheet in a coaxial-suspension coplanar waveguide transfer device, wherein the steps include:
[0038] Step A: Set the microstrip chip placement slots 3 at both symmetrical ends of the substrate cavity 4, and connect the placement slots 3 to the solder wire placement holes 2;
[0039] Step B: Wrap the input end and output end of the microstrip sheet 7 with gold foil 8 respectively;
[0040] Step C: place the microstrip sheet 7 in the microstrip sheet placement groove 3, place the solder wire in the solder wire placement hole 2, heat and melt and then cool; image 3 As shown, it is a schematic diagram of the soldering of the microstrip in the cavity, and the part 5 in the figure is a schematic representation of soldering and heating to fix the micro...
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