Manufacturing method of high-frequency circuit board and circuit board prepared by the method

Abstract

The invention provides a manufacture method for a high-frequency circuit board and a circuit board manufactured through the method. The manufacture method comprises the steps of providing a high-frequency material core board, manufacturing an inner figure, and retaining a copper layer at a corresponding position of the bottom of a groove to be formed; providing a plurality of common core boards and prepregs, manufacturing inner figures on the core boards, and laminating the common core boards and the prepregs with the high-frequency material core board to form a body board, wherein the high-frequency material core board is disposed on the outer layer; performing depth-control groove milling on the body board, and retaining certain thickness between the prepreg layer of the groove bottom and the copper layer of the high-frequency material core board; removing the prepreg layer on the surface remaining on the copper layer through laser ablation and exposing the copper layer; and etching and removing the exposed copper layer to manufacture the high-frequency circuit board. According to the manufacture method, the groove of small size can be manufactured, damage to the high-frequency material medium at the bottom of the groove can be prevented, and the medium completeness at the groove bottom is guaranteed.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to a method for making a high-frequency circuit board with small-sized non-metallized grooves and a circuit board prepared by the method. Background technique [0002] In the manufacture of high-frequency circuit boards, non-immersion copper grooves are usually designed, and only a high-frequency material dielectric layer is left at the bottom of the grooves to reduce signal loss. At present, methods such as buried pads and controlled depth milling are usually used in the manufacture of non-immersed copper grooves. However, as the signal frequency becomes higher and higher, the corresponding groove size becomes smaller and smaller, and the integrity of the high-frequency material dielectric layer at the bottom of the groove is increasingly required, and the high-frequency dielectric layer is not allowed to be damaged. In the production of the existing buried gasket method, due to...

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Problems solved by technology

However, as the signal frequency becomes higher and higher, the corresponding groove size becomes smaller and smaller, and the integrity of the high-frequency material dielectric layer at the bottom of the groove is increasingly required, and the high-frequency dielectric layer is not allowed to be damaged.

In the production of the existing buried gasket method, due to the limitation of the processing capacity of the gasket size and the operation limitation of putting in the small gasket when laminating and pressing the board, it is impossible to realize the production of small-sized grooves, and the traditional buried gasket is used The method has the problem that when the gasket is taken out, the tool is easy to scratch the bottom of the groove, damage the surface of the high-frequency material core board at the bottom of the groove, and is prone to the problem of glue flow; in addition, using controlled depth milling to make small-sized grooves, due to certain Depth control tolerance, so the bottom of the groove cannot guarantee the integrity of the high-frequency medium without damage, and cannot realize the production of such high-frequency small-size grooves

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