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Phenolic resin and thermosetting resin composition

A technology of resin composition and phenolic resin, which is applied in the field of thermosetting resin composition, can solve the problems of insufficient heat resistance of the cured product, and achieve the effect of good fluidity and excellent moisture resistance

Inactive Publication Date: 2016-09-28
AICA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the phenolic resin described in Patent Document 2, fluidity is imparted by increasing the ratio of 3 mol or less phenolic compounds condensed with respect to 1 mol of dialdehyde compounds, so although the fluidity is improved, the cured product has Insufficient heat resistance

Method used

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  • Phenolic resin and thermosetting resin composition
  • Phenolic resin and thermosetting resin composition
  • Phenolic resin and thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] Embodiment 1 (synthesis of phenolic resin)

[0075]100 g of resorcinol, 26 g of acetone, and 0.1 g of p-toluenesulfonic acid were added to a flask equipped with a cooling tube and a stirrer, and reacted at 80° C. for 2 hours. Next, 26 g of acetone was added and reacted at 80° C. for 2 hours. Then, it was washed four times with 100 g of pure water to remove the catalyst and unreacted resorcinol. Then, the distillate was removed at 150° C. under a reduced pressure of 50 mmHg to obtain 76 g of phenol resin A-1 as white crystals. The obtained phenol resin A-1 had a melting point of 200°C. 76 g of phenol resin A-1 was dissolved in 95 g of acetone, and then 19 g of nitrogen-containing phenol resin B-1 (manufactured by Showa Denko, Shounol BRM-5622, softening temperature 82°C, hydroxyl equivalent 160) was added and dissolved , the nitrogen-containing phenol resin B-1 is obtained by using dimethylolethylene urea as the nitrogen-containing compound and phenol as the phenolic ...

Embodiment 2

[0076] Embodiment 2 (synthesis of phenolic resin)

[0077] Except having used 57 g of phenol resin A-1 and 38 g of nitrogen-containing phenol resin B-1, it reacted similarly to Example 1, and obtained 95 g of phenol resin AN2. The softening temperature of the obtained phenol resin AN2 was 94°C.

Embodiment 3

[0078] Embodiment 3 (synthesis of phenolic resin)

[0079] 100 g of resorcinol, 65 g of acetone, and 0.1 g of p-toluenesulfonic acid were added to a flask equipped with a cooling tube and a stirrer, and reacted at 90° C. for 5 hours. Then, it was washed four times with 100 g of pure water to remove the catalyst and unreacted resorcinol. Then, the distillate was removed at 150° C. under a reduced pressure of 50 mmHg to obtain 94 g of light brown lumpy phenol resin A-2. The softening temperature of the obtained phenol resin A-2 was 119 degreeC. 76 g of phenol resin A-2 was dissolved in 95 g of acetone, and then 19 g of nitrogen-containing phenol resin B-1 was added and dissolved. Next, the distillate was removed at 150° C. under a reduced pressure of 50 mmHg to obtain 95 g of light brown lumpy phenol resin BN1. The softening temperature of the obtained phenol resin BN1 was 104 degreeC.

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Abstract

PROBLEM TO BE SOLVED: To provide a phenol resin that is an epoxy resin curing agent giving a thermosetting resin composition with good flowability and further giving a cured product excellent in thermal resistance and moisture resistance.SOLUTION: A phenol resin comprises, as essential components: a phenolic hydroxy group-containing compound formed by reacting phenols with acetone under acidity; and a nitrogen-containing phenol resin obtained by reacting a dimethylol body being a nitrogen-containing compound with phenols.

Description

technical field [0001] The present invention relates to a phenol resin as an epoxy resin curing agent capable of obtaining a thermosetting resin composition with good fluidity and capable of obtaining a cured product excellent in heat resistance and moisture resistance, and a thermosetting resin composition containing the phenol resin . Background technique [0002] A thermosetting resin composition composed of an epoxy resin and a phenol resin (curing agent) is used in various fields because its cured product is excellent in heat resistance, adhesion, and electrical insulation. For example, it can be used as a resin composition for printed circuit boards, a resin composition for interlayer insulating materials used in printed circuit boards and copper foils with resins, a resin composition for sealing materials for electronic parts, solder resist inks, conductive pastes (containing Conductive fillers), coatings, adhesives, composite materials, etc. [0003] Especially for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08G8/02
CPCC08G14/06C08G59/46C08L61/12C08L61/20C08L2201/02
Inventor 泷本进一
Owner AICA KOGYO CO LTD