Resin adhesive free from formaldehyde release as well as preparation method and application thereof

A resin adhesive and formaldehyde release technology, applied in the polymer field, can solve the problems of difficulty, reduce the amount of formaldehyde released, and fail to meet the requirements of use, and achieve the effect of stable structure and excellent performance.

Inactive Publication Date: 2013-09-18
SOUTHWEST FORESTRY UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, low molar ratio formulation is the most effective and economical method to reduce formaldehyde emission, but with the decrease of molar ratio (F/U), the performance of UF resin deteriorates significantly
Secondly, although changing

Method used

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  • Resin adhesive free from formaldehyde release as well as preparation method and application thereof

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preparation example Construction

[0019] The preparation method of the formaldehyde-free resin adhesive of the present invention includes raw material preparation, primary synthesis, and secondary synthesis steps, specifically including:

[0020] A. Raw material preparation: Weigh respectively according to the molar ratio of raw material urea and glyoxal 1:1~2, and then divide the weighed glyoxal into two parts. The aldehyde molar ratio is 1:0.8~1 for weighing, and the rest is the second part of glyoxal;

[0021] B. One-time synthesis: adjust the pH value of the first part of glyoxal to 2~6 with a pH regulator, add the raw material urea while stirring, and react at 70~80°C for 90~120min to obtain the resin glyoxal-urea resin low Polymer;

[0022] C. Secondary synthesis: add the second part of glyoxal to the obtained resin glyoxal-urea resin oligomer, adjust the pH value to 3~8.5 with a pH regulator, and react at 70~80°C for 60~90min , to obtain the target product after cooling treatment.

[0023] The pH reg...

Embodiment 1

[0033] A. Weigh 2.0 moles of glyoxal for the first time, adjust the pH value to 3.0-4.0, add 2.3 moles of urea under stirring, and keep the reaction at 70°C for 120 minutes to obtain the resin glyoxal-urea resin oligomer (UG);

[0034] B. Add 1.3 moles of glyoxal for the second time, adjust the pH value between 3.0-4.0, keep the reaction at 75°C for 80 minutes, cool to below 40°C, adjust the pH to 7~8 and discharge to obtain urea-B Dialdehyde (UG) resin wood adhesive.

Embodiment 2

[0036] A. Weigh 2.0 moles of glyoxal for the first time, adjust the pH value at 3.0-4.0, add 2.5 moles of urea under stirring, and keep the reaction at 80°C for 90 minutes to obtain the resin glyoxal-urea resin oligomer (UG);

[0037] B. Add 0.5 moles of glyoxal for the second time, adjust the pH value between 3.0-4.0, keep the temperature at 70°C for 90 minutes, cool to below 40°C, adjust the pH to 7~8, and then discharge to obtain urea-B Dialdehyde (UG) resin wood adhesive.

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Abstract

The invention discloses a resin adhesive free from formaldehyde release as well as a preparation method and an application thereof. The resin adhesive free from formaldehyde release is a urea-glyoxal resin adhesive, and is prepared from urea and glyoxal at a mol ratio of 1:(1-2) through stepwise synthesis. The preparation method comprises the following steps of: raw material preparation, primary synthesis and secondary synthesis, and specifically comprises step of weighing raw materials, dividing glyoxal into two parts, adding urea to the first part of glyoxal and reacting to obtain glyoxal-urea resin oligomer, adding the second part of glyoxal to the oligomer and reacting, and cooling and treating to obtain a target object. The application is the application of the resin adhesive free from formaldehyde release in artificial board production in wood industry, clothing manufacturing and paper-making production. The resin adhesive free from formaldehyde release is stable in structure, free from formaldehyde release and excellent in performance, and is applicable to production of artificial board, in particular of plywood and chipboard, as well as to clothing manufacturing, paper making and other fields.

Description

technical field [0001] The invention belongs to the technical field of polymers, and in particular relates to a formaldehyde-free resin adhesive and a preparation method and application thereof. Background technique [0002] The application of synthetic resin has greatly improved the production efficiency and product quality of the wood industry, especially the application of formaldehyde-based adhesives (urea-formaldehyde resin, phenolic resin and melamine-formaldehyde resin) has greatly promoted the rapid development of the wood-based panel industry . Among them, urea-formaldehyde resin (UF) is widely used in indoor plywood, particleboard, medium density fiberboard and joinery in the wood processing industry due to its advantages such as low price, simple production process, convenient use, light color, fast curing, and excellent gluing performance. In industries such as boards, its usage accounts for about 80% of the total amount of wood adhesives. It is the most importa...

Claims

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Application Information

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IPC IPC(8): C09J161/24C08G12/12
Inventor 邓书端杜官本李向红
Owner SOUTHWEST FORESTRY UNIVERSITY
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