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Pressure sensor chip

A pressure sensor and sensor technology, applied in the direction of measuring fluid pressure, instruments, and pressure difference measurement between multiple valves, to achieve the effect of ensuring pressure resistance and reducing stress

Active Publication Date: 2013-09-18
YAMATAKE HONEYWELL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the pressure sensor chip 1 is protected from excessive pressure Pover by including recesses 10a, 10b for restricting the displacement of the central diaphragm 6 and barrier diaphragms 5a, 5b, it cannot be avoided. enlargement of its shape

Method used

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Examples

Experimental program
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Effect test

Embodiment approach 1

[0044] figure 1 It is a schematic diagram of an embodiment (Embodiment 1) of the pressure sensor chip of the present invention. In this figure, with Figure 10 same notation as with reference to Figure 10 The components described are the same or equivalent, and their descriptions are omitted. In addition, in this embodiment, the pressure sensor chip is denoted by symbol 11A to distinguish it from Figure 10 The pressure sensor chip 11 is shown.

[0045] In this pressure sensor chip 11A, among regions S1 where the peripheral portion 11-2c of the stopper member 11-2 faces one surface of the sensor diaphragm 11-1, the region S1a on the outer peripheral side is in contact with one surface of the sensor diaphragm 11-1. The region S1b on the inner peripheral side serves as a non-joint region that is not bonded to one surface of the sensor diaphragm 11-1. In addition, among the regions S2 where the peripheral portion 11-3c of the stopper member 11-3 faces the other surface of ...

Embodiment approach 2

[0055] In Embodiment 1, the stopper members are provided on both surfaces of the sensor diaphragm 11-1, but if the surface of the sensor diaphragm 11-1 that receives the measurement pressure on the high-pressure side must be determined, the stopper members may be provided only on the side that receives the high-pressure side. A stopper member is provided on the surface opposite to the pressure measurement surface (the surface bearing the measurement pressure of the low pressure side), and only the holding member is provided on the surface bearing the measurement pressure of the high pressure side. The structure of this pressure sensor chip is in image 3 is shown as Embodiment 2 in .

[0056] In this pressure sensor chip 11B, the measured pressure Pb must be determined as the measured pressure on the high-pressure side, and the stopper member 11-2 is provided only on one surface of the sensor diaphragm 11-1 that bears the measured pressure Pa on the low-pressure side. Only th...

Embodiment approach 3

[0060]In Embodiment 1, stopper members are provided on both sides of the sensor diaphragm 11-1, but it is also possible to remove the excessive pressure protection function on both sides of the sensor diaphragm 11-1, and only provide a retaining member on both sides of the sensor diaphragm 11-1. member. The structure of this pressure sensor chip is in Figure 4 is shown as Embodiment 3 in .

[0061] On the pressure sensor chip 11C, a holding member 11-7 is provided on one surface of the sensor diaphragm 11-1, and a holding member 11-6 is provided on the other surface of the sensor diaphragm 11-1. That is, the recesses 11-6a, 11-7a of the holding members 11-6, 11-7 do not have curved surfaces along the displacement of the sensor diaphragm 11-1, and do not function as members for protecting against excessive pressure.

[0062] In addition, in this pressure sensor chip 11C, among the regions S3 where the peripheral portion 11-6c of the holding member 11-6 faces the other surfac...

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Abstract

The invention relates to a pressure sensor chip, which reduces stress because of restraint of a sensor diaphragm, and ensures desired pressure resistance. In a region S1 of a peripheral edge portion 11-2c of the stopper member 11-2 that faces one face of the sensor diaphragm 11-1, a region Sla on the outer peripheral side is a region that is bonded to the one face of the sensor diaphragm 11-1; and a region S1b on the inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm 11-1. When the measurement pressure Pa is the measurement pressure on the high-pressure side and the measurement pressure Pb is the measurement pressure on the low-pressure side, and if the measurement pressure Pa of the high-pressure side is applied onto one face of the sensor diaphragm, the sensor diaphragm 11-1 is able to flex without producing excessive tensile forces due to the constraints from the stopper member 11-2 at the non-bonded region S1b of the stopper member 11-2, thus reducing the stress produced at that part.

Description

technical field [0001] The present invention relates to a pressure sensor chip using a sensor diaphragm that outputs a signal corresponding to a pressure difference. A pressure sensor chip that detects the pressure applied to the diaphragm by changing the resistance value. Background technique [0002] Conventionally, as a differential pressure transmitter (signal converter) for industrial use, a differential pressure transmitter incorporating a pressure sensor chip using a sensor diaphragm that outputs a signal corresponding to the pressure difference has been used. This type of differential pressure transmitter is structured such that the measured pressures applied to the pressure-receiving diaphragms on the high-pressure side and the low-pressure side are guided to one side and the other side of the sensor diaphragm by the filling liquid as a pressure transmission medium, and the sensor detects the pressure. The deformation of the diaphragm is, for example, a change in t...

Claims

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Application Information

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IPC IPC(8): G01L9/04
CPCG01L13/025G01L9/00G01L13/06G01L19/06G01L9/0083G01L9/0092
Inventor 濑户祐希德田智久
Owner YAMATAKE HONEYWELL CO LTD
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