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Method of manufacturing resonator element, method of manufacturing resonator, resonator, oscillator, and electronic apparatus

A manufacturing method and technology of electronic equipment, applied in piezoelectric devices/electrostrictive devices, circuits, electrical components, etc., can solve problems such as difficulty in managing vibration characteristics of quartz vibrating plates, and inability to accurately measure the width of an effective vibration area.

Active Publication Date: 2013-09-18
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] As mentioned above, there is a problem in the conventional method of manufacturing a quartz vibrating piece that the width of the effective vibration region cannot be accurately measured, and it is difficult to manufacture a quartz vibrating piece that is difficult to control the vibration characteristics (quality)

Method used

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  • Method of manufacturing resonator element, method of manufacturing resonator, resonator, oscillator, and electronic apparatus
  • Method of manufacturing resonator element, method of manufacturing resonator, resonator, oscillator, and electronic apparatus
  • Method of manufacturing resonator element, method of manufacturing resonator, resonator, oscillator, and electronic apparatus

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no. 1 Embodiment approach ＞

[0076] figure 1 It is a plan view of the vibrator according to the first embodiment of the present invention, figure 2 yes figure 1 The A-A line sectional view in, image 3 yes figure 1 The top view of the vibrating piece of the shown vibrator, (a) is the upper surface view, (b) is the lower surface view, Figure 4 yes figure 1 The B-B line sectional view in, Figure 5 yes figure 1 The shown vibrator has a partial enlarged view of the vibrating plate, (a) is an enlarged view of the upper surface, (b) is an enlarged view of the lower surface, Figure 6 and Figure 7 is for illustration image 3 The sectional view of the manufacturing method of the vibrating piece shown. In addition, for the convenience of explanation below, the figure 2 The upper side is called "upper" and the lower side is called "lower".

[0077] 1. Vibrator

[0078] figure 1 and figure 2 The illustrated vibrator 1 has a vibrating piece 2 (the vibrating piece of the present invention) a...

no. 2 Embodiment approach ＞

[0135] Next, a second embodiment of the vibrator of the present invention will be described.

[0136] Figure 8 It is a cross-sectional view of a vibrator according to a second embodiment of the present invention.

[0137] Hereinafter, the vibrator of the second embodiment will be described focusing on differences from the first embodiment, and descriptions of the same items will be omitted.

[0138] The vibrator according to the second embodiment of the present invention is the same as that of the first embodiment described above except that the structure of the package is different. In addition, the same code|symbol is attached|subjected to the same structure as said 1st Embodiment.

[0139] Such as Figure 8 As shown, the package 9A has a plate-shaped (flat-shaped) base 91A and a cap-shaped cover 92A having a concave portion 921 whose lower surface is open. In such a package 9A, a storage space S is formed by closing the opening of the recess 921 with the base 91A, and ...

no. 3 Embodiment approach ＞

[0142] Next, a third embodiment of the vibrator of the present invention will be described.

[0143] Figure 9 It is a cross-sectional view of a vibrator according to a third embodiment of the present invention.

[0144] Hereinafter, the vibrator of the third embodiment will be described focusing on differences from the first embodiment, and the description of the same items will be omitted.

[0145] The vibrator according to the third embodiment of the present invention is the same as the above-mentioned first embodiment except that it further includes electronic components and the structure of the package is different. In addition, the same code|symbol is attached|subjected to the same structure as said 1st Embodiment.

[0146] Such as Figure 9 As shown, the vibrator 1 of the present embodiment has a vibrating element 2 , a package 9 for accommodating the vibrating element 2 , and a temperature sensing element (electronic element) 6 for detecting the temperature of the v...

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Abstract

The invention relatest to a method of manufacturing resonator element, a method of manufacturing resonator, a resonator, an oscillator, and an electronic apparatus. The method of manufacturing resonator element has the effective vibrating region of the vibrating section the width of which can easily and accurately be measured, and has the vibration characteristics easy to control. The method of manufacturing a resonator element includes a first step of preparing an AT-cut quartz crystal substrate; a process of forming a mesa substrate by disposing a first mask on a principal surface located on a +Y'-axis side of the quartz crystal substrate, disposing a second mask on a principal surface located on a -Y'-axis side so as to be located at a position shifted toward a +Z'-axis side from the first mask, and etching the quartz crystal substrate via the first and second masks, the mesa substrate including a vibrating section including a first protruding section protruding toward the +Y'-axis side and a second protruding section protruding toward the -Y'-axis side, and a small-thickness section disposed along an outer edge of the vibrating section and having a thickness smaller than a thickness of the vibrating section; and a step of forming conductive pattern to the mesa substrate.

Description

technical field [0001] The present invention relates to a manufacturing method of a vibrating piece, a manufacturing method of a vibrator, a vibrator, an oscillator and electronic equipment. Background technique [0002] Conventionally, a vibrating piece (vibrator or oscillator) using quartz is known. Such vibrators have excellent frequency-temperature characteristics, and are therefore widely used as reference frequency sources or oscillation sources for various electronic devices. In particular, a vibrating piece using a quartz substrate cut at a cut angle called an AT cut has a frequency-temperature characteristic showing a cubic curve, and is therefore widely used in mobile communication devices such as mobile phones (see, for example, Patent Document 1). [0003] As disclosed in Patent Document 1, a so-called bi-mesa type vibration piece is known as a vibration piece using an AT-cut quartz substrate. The double mesa type refers to a thick-walled vibrating part and a t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H03H9/05H03H9/19H10N30/00H10N30/01H10N30/082H10N30/20H10N30/85
CPCH03H3/02H03H9/1021H03H9/02015H03H9/0547Y10T29/42H10N30/082
Inventor 小林淳治
Owner SEIKO EPSON CORP