Copper plating process of flexible circuit board and copper-plating hanging basket thereof

Abstract

The invention relates to a copper plating process of a flexible circuit board and a copper-plating hanging basket thereof. The process is as follows: (1), a son basket piece is sheathed into an upper plate table, and a clamp pushing device provided with strong clamps is used for respectively clipping the strong clamps along four corners of the son basket piece; (2), the son basket piece is put in the clamping slots of a mother basket, and the step (1) is repeated for filling the mother basket; and (3), plates are dismantled, the strong clamps of the son basket piece are taken down to be put in a turnover box. The hanging basket comprises the mother basket, the son basket piece, a copper-clad plate, the upper plate tables, the strong clamp pushing device and the strong clamps, wherein the mother basket comprises a basket body, clamping slot frames and a supporting frame, and the clamping slots are arranged in two side frames of each clamping slot frame; a supporting rod is arranged in the supporting frame and is vertical to the clamping slot direction; the mother basket is provided with two layers of clamping slot frames, and the middle supporting frame is arranged between the upper layer and the lower layer; and the supporting rod is movably connected with a framework through a movable button. The hanging basket has a high space use rate and is convenient to operate, an FPC (Flexible Printed Circuit) can have no hanging basket imprint, and the occurrence rate of fold is reduced. The rate of good products is increased by 30 percent, and the capacity is doubled.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board (FPC) manufacturing, in particular to a copper sinking process for a flexible circuit board and a copper sinking hanging basket used therein. Background technique [0002] The electroless copper sinking process is an important process in the manufacturing process of flexible circuit boards. The copper sinking process requires the use of sinking copper hanging baskets, which usually leave hanging basket marks or wrinkles on the circuit board. At present, the industry generally adopts the method of wearing Teflon wire or perforating the sinking copper hanging basket to reduce the hanging basket mark and reduce the wrinkles caused by the sinking copper process. [0003] The existing immersion copper hanging basket with Teflon wire has the following disadvantages: 1. The area where the product contacts the Teflon wire is relatively rough. After copper plating, this part is rougher and p...

AI Technical Summary

Problems solved by technology

[0003] The existing immersion copper hanging basket with Teflon wire has the following disadvantages: 1. The area where the product contacts the Teflon wire is relatively rough. After copper plating, this part is rougher and produces a certain amount of copper particles. In the line area, there will be the possibility of short-circuit; 2. During the production process of the sinking copper wire, the product will cause wrinkles between the two sets of Teflon wires due to the tumbling of the bath, which is easy to cause short-term defects, resulting in a decline in the final yield

[0004] The existing hanging baskets that adopt the perforation method have the following disadvantages: the product must be drilled at the four corners. When putting on the hanging basket, first use stainless steel wires to pass through the four holes, then add stainless steel beads to isolate, and then pass through a board; Repeat the above steps from time to time, hoping to reduce the hanging basket mark or reduce the generation of wrinkles to a certain extent; the above-mentioned hanging basket with perforation method has low production efficiency, and the effect is not ideal, and only slightly reduces the wrinkle defect rate

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