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Three-convex-beam micromechanical accelerometer

An acceleration sensor and micro-mechanical technology, applied in the direction of acceleration measurement using inertial force, can solve the problems of frequency and sensitivity mutual constraints, high sensitivity, low sensitivity, etc., and achieve the effect of small lateral effect, high sensitivity, and large sensitivity

Inactive Publication Date: 2014-12-03
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cantilever beam micro accelerometers have the problem of mutual restriction between frequency and sensitivity, that is, high frequency means low sensitivity, and low frequency means high sensitivity

Method used

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  • Three-convex-beam micromechanical accelerometer

Examples

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Effect test

Embodiment 1

[0026] figure 1 It is a structural schematic diagram of the micromechanical piezoresistive acceleration sensor of the present invention. exist figure 1 Among them, a three-convex beam type micromachined acceleration sensor of the present invention includes a sensitive chip and a lower glass plate 5; wherein, the sensitive chip contains a first anchor region 11, a second anchor region 12, a first sensitive convex beam 21, a second Sensitive convex beam 22, third sensitive convex beam 23, first mass block 31, second mass block 32, first varistor 41, second varistor 42, third varistor 43, fourth varistor 44, the connection relationship is that the second sensitive convex beam 22 is connected to one end of the first mass block 31 and the second mass block 32 respectively, and the other end of the first mass block 31 is connected to the first sensitive convex beam 21, The other end of the second quality block 32 is connected with the third sensitive convex beam 23 to form the mov...

Embodiment 2

[0037] The structure of this embodiment is the same as that of Embodiment 1, except that the width of the top of the sensitive convex beam is 150 μm, the thickness is 100 μm, and the length is 30 μm; the width of the bottom of the sensitive chip is 900 μm, the thickness is 200 μm, and the length is 30 μm; The thickness of the proof mass is 300 μm, the length is 900 μm, and the width is the same as that of the convex beam, which is 900 μm. The sensor has a natural frequency of 385kHz and a sensitivity of about 0.1μV / g / V. The gap between the movable part of the sensitive chip and the glass plate is 3 μm.

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Abstract

The invention discloses a three-convex-beam micromechanical accelerometer. The sensor comprises a sensitive chip and a lower glass plate. According to the sensitive chip, two masses with symmetrical structures and two fixedly supported ends are employed. The sensitive chip comprises two anchor zones, three sensitive convex beams, two masses, and four varistors. The connection relation of the above units is that the two masses are connected through one sensitive convex beam, the other two sensitive convex beams are respectively placed at two ends of the masses to form a movable part of the sensitive chip, four varistors are respectively arranged at the upper surface of sensitive convex beams, two ends of the movable part are respectively connected with the anchor zones to form the sensitive chip, and the sensitive chip is connected with the lower glass plate through bonding. The natural frequency of the sensor can reach more than 300KHz, the sensitivity is not decreased, and the irreconcilable contradiction between the frequency and the sensitivity in a conventional design is avoided.

Description

technical field [0001] The invention relates to a three-convex-beam type micro-mechanical acceleration sensor, which has relatively high natural frequency and small lateral effect, and belongs to the field of micro-electronic mechanical systems. Background technique [0002] With the increasing development of markets such as automotive anti-lock braking systems, guidance systems, mechanical vibration monitoring, and military fuzes, the demand for acceleration sensors is increasing. Various micromachined acceleration sensors are being continuously developed and developed, among which the research on silicon micromachined piezoresistive and capacitive acceleration sensors accounts for a considerable part. [0003] The basic working principle of the micromechanical piezoresistive acceleration sensor is based on the piezoresistive effect of the semiconductor. The beam island structure is commonly used. The mass is supported by the cantilever beam or the connecting beam, and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/12
Inventor 孙远程苏伟袁明权张茜梅王海青武蕊屈明山
Owner INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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