Cleaning agent and cleaning method for diamond-wire cutting machine

A technology of cutting machine and diamond wire, applied in the direction of cleaning method using liquid, cleaning method and utensils, detergent composition, etc., can solve problems such as temperature rise of cutting fluid, generation of line marks, debris, affecting cutting yield, etc. , to achieve the effect of low cost, strong pertinence, good wettability and dispersibility

Inactive Publication Date: 2013-10-09
镇江荣德新能源科技有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] Diamond wire multi-wire cutting requires that no particles remain in the equipment, otherwise it will affect the cutting yield; at the same time, the heat exchanger pipe cannot be blocked,

Method used

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  • Cleaning agent and cleaning method for diamond-wire cutting machine

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Embodiment Construction

[0033] The present invention will be further described below in conjunction with examples.

[0034] A cleaning agent for a diamond wire cutting machine, comprising the following components and the mass percentage of each component is:

[0035] Alkali: 0.2 to 3% (preferably 2 to 3%, more preferably 2%)

[0036] Sodium silicate: 0.3-1% (preferably 0.5-1%, more preferably 0.8%)

[0037] Silicone: 0.3 to 5% (preferably 3 to 5%, more preferably 4%)

[0038] AEO-7: 1 to 10% (preferably 4 to 7%, more preferably 5%)

[0039] AEO-9: 1 to 10% (preferably 4 to 7%, more preferably 5%)

[0040] Deionized water: balance.

[0041] Wherein, the base is an organic base or an inorganic base.

[0042] Using the above cleaning agent to clean the diamond wire cutting machine specifically includes the following steps:

[0043] (1) Mix part of deionized water, alkali and sodium silicate according to the ratio to obtain solution A;

[0044] (2) Mix part of deionized water, AEO-7, AEO-9 and org...

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Abstract

The invention discloses a cleaning agent and a cleaning method for a diamond-wire cutting machine. The cleaning agent comprises the following components: an alkali, sodium silicate, organosilicone, AEO-7, AEO-9 and deionized water. According to the cleaning agent and the cleaning method for the diamond-wire cutting machine, the cleaning agent is prepared by adding the effective components (the alkali and surfactants) into the a solvent (deionized water), the cleaning agent is a weakly alkaline solution which cannot corrode equipment, the surfactants have strong wettability and can ensure that the cleaning agent penetrates into the pipe wall to micronize the glass pipe wall, and in addition, the surfactants have good dispersibility and can ensure that the fallen micro-powder is wrapped in the solution without re-precipitating. The cleaning agent disclosed by the invention has good wettability and dispersibility, is low in cost and strong in purposiveness, and the cleaning method disclosed by the invention is simple in process, is easy to operate and can meet the environmental protection requirement.

Description

technical field [0001] The invention relates to a water-based cleaning agent, which is suitable for cleaning equipment and pipelines, in particular to a cleaning agent and a cleaning method for a diamond wire cutting machine. Background technique [0002] At present, the mainstream solar cell market is mainly single and polycrystalline silicon materials. Among them, monocrystalline silicon has high photoelectric conversion efficiency, stable performance, wide material sources, and the material itself does not cause pollution to the environment, which has a large development space. There are mainly two ways to process monocrystalline silicon wafers in the market: mortar multi-wire cutting and diamond wire multi-wire cutting. Compared with mortar cutting, diamond wire cutting has high cutting efficiency, low cost, low pollution, and does not require the use of cutting fluid, which is the development trend of single-polycrystalline cutting technology in the future. However, t...

Claims

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Application Information

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IPC IPC(8): C11D1/825C11D3/16B08B3/04
Inventor 孙亚培
Owner 镇江荣德新能源科技有限公司
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