A highly sealed led light
An LED lamp, a high-level technology, applied in the parts of lighting devices, non-polymer adhesive additives, epoxy resin glue, etc., can solve the problems of poor resistance to mechanical shock and vibration, easy to break, complicated process, etc. To achieve the effect of good weather resistance and low temperature characteristics, not easy to break, and simple sealing connection process
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Embodiment 1
[0036] Mix 100 parts of bisphenol A epoxy resin, 3 parts of hydroxyl-terminated polydimethylsiloxane, 2 parts of silane coupling agent KH5502, and 3 parts of curing agent 2-ethyl-4-methylimidazole, heat and stir evenly, pour , cured at 40° C. for 2 hours, 120° C. for 2 hours, and 160° C. for 2 hours to obtain hydroxyl-terminated polydimethylsiloxane-modified bisphenol A epoxy resin.
[0037] 80 parts of the prepared hydroxyl-terminated polydimethylsiloxane modified bisphenol A type epoxy resin, 25 parts of propylene oxide butyl ether, 20 parts of bisphenol A, 2,5-ditertbutyl p-phenylene Add 1 part of diphenol into the reaction kettle, heat and stir evenly. After the solid is completely dissolved, add 2 parts of KH5500 and 1 part of emulsified silicone oil, stir well to make it a transparent liquid, and cool it to room temperature after vacuum defoaming; 50 parts each of polyoxypropylene diamine D400 and D2000 were fully stirred at room temperature and vacuum defoamed.
[0038...
Embodiment 2
[0040] Mix 100 parts of bisphenol H-type epoxy resin, 3 parts of hydroxyl-terminated polydimethylsiloxane, 2 parts of silane coupling agent KH5602, and 3 parts of curing agent 2-ethyl-4-methylimidazole, heat and stir evenly, and pour , cured at 50° C. for 2 hours, 130° C. for 2 hours, and 150° C. for 2 hours to obtain hydroxyl-terminated polydimethylsiloxane-modified bisphenol H-type epoxy resin.
[0041] 90 parts of the prepared hydroxyl-terminated polydimethylsiloxane modified bisphenol H-type epoxy resin, 30 parts of diglycidyl ether, 25 parts of tetrabromobisphenol A, 2,4,6-tritertbutyl Add 2 parts of phenol into the reaction kettle, heat and stir evenly. After the solid is completely dissolved, add 3 parts of KH560 and 1 part of emulsified silicone oil, stir well to make it a transparent liquid, and cool it to room temperature after vacuum defoaming; 40 parts of propylene oxide diamine D4000 and 60 parts of D200006 were fully stirred at room temperature and vacuum defoame...
Embodiment 3
[0044] Mix 100 parts of alicyclic epoxy resin, 8 parts of hydroxyl-terminated polydimethylsiloxane, 4 parts of silane coupling agent KH5704, and 5 parts of curing agent 2-ethyl-4-methylimidazole, heat and stir evenly, pour, respectively Curing at 30° C. for 3 hours, 110° C. for 3 hours, and 160° C. for 3 hours to obtain a hydroxyl-terminated polydimethylsiloxane-modified alicyclic epoxy resin.
[0045] 95 parts of hydroxyl-terminated polydimethylsiloxane modified alicyclic epoxy resins, 25 parts of propylene oxide butyl ethers, 30 parts of alkyl phthalates, 4,4'-bis( Add 3 parts of 2,6-di-tert-butylphenol) into the reaction kettle, heat and stir evenly, after the solid is completely dissolved, add 3 parts of KH570, 2 parts of emulsified silicone oil, stir fully to make it a transparent liquid, vacuum defoaming After cooling to room temperature; 50 parts of polyoxypropylene diamine D230 and 80 parts of D2000080 parts of curing agent polyoxypropylene diamine are fully stirred at...
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