Vibration device and method for manufacturing vibration device
A technology of a vibration device and a manufacturing method, which is applied in the direction of measuring devices, manufacturing tools, and gyro effect for speed measurement, etc., and can solve problems such as semiconductor substrate damage and surface area increase
Active Publication Date: 2013-10-23
SEIKO EPSON CORP
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Problems solved by technology
[0005] However, in the vibrating device with such a structure, when the laser beam transmitted through the vibrating element is irradiated on the semiconductor substrate, there is a possibility of causing damage to the semiconductor substrate.
In addition, since the vibrating element is mounted on the semiconductor substrate, there is another problem that the surface area of the semiconductor substrate is larger than the surface area of the vibrating element.
Method used
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[0033] Embodiments of the present invention will be described below with reference to the drawings. In addition, in each of the drawings shown below, in order to make each constituent element a size that can be recognized on the drawings, there are cases where the dimensions or ratios of each constituent element are appropriately different from those of the actual constituent elements. Condition. In addition, an XYZ rectangular coordinate system is set, and the positional relationship between each part is demonstrated with reference to this XYZ rectangular coordinate system. A predetermined direction in the vertical plane is defined as the X-axis direction, a direction perpendicular to the X-axis direction in the vertical plane is defined as the Y-axis direction, and directions perpendicular to the X-axis direction and the Y direction are defined as the Z direction. In addition, on the basis of the direction of gravity, the direction of gravity is defined as downward, and the...
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Abstract
A vibration device includes: a semiconductor substrate; a first electrode provided on a first surface of the semiconductor substrate; a protective layer provided on the first surface and covering an end section of the first surface; and a vibration element having a vibration section, a mass adjusting section located on the vibration section and a second electrode. The vibration element is mounted on the first surface with the first electrode and the second electrode connected together, in a manner that the mass adjusting section is located in an area that overlaps the protective layer in a plan view, and a part of the vibration element is disposed at a position that does not overlap the first surface in a plan view.
Description
technical field [0001] The invention relates to a vibrating device and a manufacturing method of the vibrating device. Background technique [0002] Conventionally, a vibrating device including a vibrating element as a sensor element and a circuit element having a function of driving the vibrating element is known as a sensor device for sensing acceleration, angular velocity, and the like. [0003] In addition, as such a vibrating device, Patent Document 1 discloses a vibrating device in which a sensor device including a gyro vibrating piece as a vibrating element and a semiconductor substrate provided with a circuit element is housed in a package. . [0004] In the vibration device with such a structure, the vibration element is mounted on the semiconductor substrate in a stacked manner, and in the adjustment of the vibration frequency of the vibration element, a mass adjustment part (electrodes, etc.) for removing the vibration element is used. ) of the laser. [0005] ...
Claims
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IPC IPC(8): G01C19/5607G01P15/08B23K26/03
CPCG01H17/00G01C19/5628G01C19/5621Y10T29/49004
Inventor 花冈辉直
Owner SEIKO EPSON CORP