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Circuit board with electrostatic protection structure

An electrostatic protection and circuit board technology, applied in the direction of electrostatic discharge protection of circuits, static electricity, printed circuits, etc., can solve problems such as damage to electronic components 10, and achieve the effect of protection from damage

Inactive Publication Date: 2013-10-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, static electricity may flow through these electronic components during conduction, and enter the electronic component 10 through the ground pin GND of the electronic component 10 (such as figure 1 in the direction of the arrow), thereby causing damage to the electronic component 10

Method used

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  • Circuit board with electrostatic protection structure
  • Circuit board with electrostatic protection structure

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Embodiment Construction

[0012] figure 2 It is a schematic diagram of the printed circuit board structure provided by the present invention with a multilayer structure for preventing static electricity from flowing backward. The printed circuit board 40 of this multilayer structure includes a conductive layer 41, a ground layer 42 and an insulating layer 43 formed between the conductive layer 41 and the ground layer 42. Wherein, the conductive layer 41 provides current through, and the insulating layer 43 is used to isolate the current between the conductive layer 41 and the ground layer 42. The conductive layer 41 of the circuit board 40 is also connected to the large area ground (not shown in the figure) of the circuit board 40. When the static electricity 30 directly strikes the conductive layer 41, the static electricity will be directly conducted along the conductive layer 41 to the large area ground. .

[0013] The circuit board 40 is also provided with a plurality of vias 44 for soldering a plur...

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PUM

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Abstract

The invention discloses a circuit board with an electrostatic protection structure. The circuit board comprises a conducting layer, a ground layer, an insulating layer and a plurality of via holes, wherein the insulating layer is formed between the conducting layer and the ground layer, and the via holes are used for welding an electronic component. The conducting layer allows currents to pass through. The insulating layer is used for isolating the currents between the conducting layer and the ground layer. The electronic component comprises a ground pin, the insulating layer coats the parts of the inner walls of the via holes corresponding to the ground pin, on the conducting layer, and so that the via holes are isolated from the conducting layer; a metal layer coats the parts of the inner walls of the via holes, on the ground layer, so that the via holes are electrically connected with the ground layer, and a complete electrical loop is provided for the electronic component. According to the circuit board with the electrostatic protection structure, on one hand, the ground pin of the electronic component is electrically connected with the ground layer of the circuit board so that the complete electrical loop can be formed; on the other hand, the ground pin of the electronic component is isolated from the conducting layer which makes direct contact with static electricity so that the static electricity can be prevented from reversely flowing into the ground pin of the electronic component from the conducting layer of the circuit board directly, and thus the electronic component can be protected from being damaged.

Description

Technical field [0001] The invention relates to a circuit board, in particular to a circuit board with an electrostatic protection structure. Background technique [0002] Electrostatic interference is a major problem in the current electronics industry, and the quality of electrostatic protection directly affects the quality of electronic equipment. Existing electronic equipment generally uses electrostatic protection components, electrostatic shielding covers, mechanical casings, or enlargement of the grounding area to allow static electricity to be conducted to the ground better and faster to protect the electronic equipment. [0003] Such as figure 1 As shown, a circuit board 20 with a multilayer structure includes a conductive layer 21, a ground layer 22, and an insulating layer 23 formed between the conductive layer 21 and the ground layer 22. Wherein, the conductive layer 21 provides current through, and the insulating layer 23 is used to isolate the current between the con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05F3/02
CPCH05K2201/09309H05K1/0259H05K1/09H05K1/0225H05K1/0296H05K1/0216
Inventor 唐海东
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD