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Heat dissipating device

A technology of heat dissipation device and heat dissipation hole, which is applied in cooling/ventilation/heating transformation, electrical components, magnetic field/electric field shielding, etc., can solve the problem of inability to prevent electromagnetic interference, and achieve the effect of reducing electromagnetic interference

Inactive Publication Date: 2013-10-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the air guide is generally made of plastic and the two ends of the air guide are provided with openings for the air to enter and exit, which cannot play the role of preventing electromagnetic interference (EMI)

Method used

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Examples

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Embodiment Construction

[0015] see Figure 1 to Figure 3 , the heat dissipation device 100 of the present invention is used to dissipate heat to a plurality of electronic components 304 on a circuit board 302 . The circuit board 302 is installed in an electronic device 300 , and a plurality of fastening holes 306 are respectively defined on opposite sides of the circuit board 302 . The heat dissipation device 100 includes a wind deflector 20 and a plurality of fans 40 . The fans 40 are installed in the electronic device 300 facing the electronic components 304 .

[0016] The air guide cover 20 is made of plastic, one end is provided with an air inlet 22, and the opposite end is provided with an air outlet 24, and the air inlet 22 and the air outlet 24 are respectively provided with a mesh plate 25 with a plurality of cooling holes 252 . The cooling holes 252 are arranged in an array, and the diameter of each cooling hole 252 is less than 5 mm. The inner surfaces of the air guide 20 and the mesh p...

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Abstract

Disclosed is a heat dissipating device used for dissipating heat for a plurality of electronic components of a circuit board. The heat dissipating device comprises a wind scooper made of plastic, and a fan. The wind scooper is disposed on the circuit board and shields the electronic components. The wind scooper includes an air inlet and an air outlet. The fan is disposed right toward the air inlet. The air inlet and the air outlet each are provided with a mesh plate which is provided with a plurality of heat dissipating holes. An inner surface of the wind scooper is provided with a layer of metal powder. The heat dissipating device not only can achieve a heat dissipating effect through the heat dissipating holes and the wind scooper, but also can reduce electromagnetic interference through the layer of metal powder and the heat dissipating holes.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device capable of effectively reducing electromagnetic interference. Background technique [0002] With the rapid increase of the operating frequency of electronic components, the heat generated by them is also increasing. If the heat generated is not dissipated in time, the high temperature will affect the stability of electronic components during operation, and may even cause the entire Electronic components burnt out. Therefore, air ducts and fans are often used to dissipate heat from electronic components. However, the wind deflector is generally made of plastic, and the two ends of the wind deflector are provided with openings for air flow in and out, which cannot prevent electromagnetic interference (EMI). Contents of the invention [0003] In view of the above, it is necessary to provide a heat dissipation device that reduces electromagnetic interference....

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K9/00
Inventor 林智壕
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD