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Lead-free electrode slurry used for chip resistor

A resistor and surface electrode technology, applied in the field of lead-free surface electrode paste for chip resistors, can solve problems such as poor conductivity

Inactive Publication Date: 2013-11-13
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the commonly used lead-free surface electrode paste for chip resistors is mainly lead-free electrode paste. The components of lead-free electrode paste mainly include silver powder, organic carrier and glass powder, but most chip resistors use lead-free surface electrode paste The electrical conductivity of the material is not good

Method used

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  • Lead-free electrode slurry used for chip resistor
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  • Lead-free electrode slurry used for chip resistor

Examples

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Embodiment

[0034] The formula composition of the embodiment is shown in Table 1, and the properties of the lead-free surface electrode paste for the chip resistor prepared according to the formula in Table 1 are shown in Table 2.

[0035] Table 1

[0036]

[0037]

[0038] Note: ※ Expressed as a submicron to flake weight ratio of 1:1.

[0039] Table 2

[0040]

[0041]

[0042] As can be seen from the above, the resistivity of the lead-free surface electrode paste for chip resistors prepared according to the formulation of the lead-free surface electrode paste for chip resistors of the present invention is low, and its conductivity is excellent. At the same time, the silver layer after sintering Dense, good adhesion, good weldability.

[0043] The formula of the example of lead-free surface electrode paste for chip resistors with inorganic additives is shown in Table 3. The lead-free surface electrode paste for chip resistors prepared according to the formula in Table 3, a...

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Abstract

A lead-free electrode slurry used for a chip resistor comprises components in percentage by weight as follows: 70%-75% of silver powder, 4%-6% of glass powder and 19%-26% of an organic carrier, wherein the silver powder comprises components in percentage by weight as follows: 40%-60% of sub-micro silver powder and 40%-60% of flake silver powder; and the organic carrier comprises components in percentage by weight as follows: 5%-20% of polymer resin, 1%-5% of an organic addition agent and 75%-94% of an organic solvent. According to the lead-free electrode slurry used for the chip resistor, the sub-micro silver powder and the flake silver powder are matched to serve as a conducting phase and are mutually stacked and filled after sintered, so that gaps in the silver powder are effectively filled up, a silver layer is compact after the electrode slurry is sintered, the promotion of the electrical conductivity is facilitated, and the electrical conductivity is better.

Description

technical field [0001] The invention relates to an electrode paste, in particular to a lead-free surface electrode paste for a chip resistor. Background technique [0002] The main application fields of chip resistors are computers, communications, home appliances, mobile phones, digital consumer goods, automotive electronics, lighting, etc. Most of these industries maintain an annual growth rate of more than 10%. [0003] At present, the electrode silver paste used in chip resistors is mainly from abroad, and there are no mature products in China that can be applied in this field, but the silver paste has high technical content and high added value; therefore, mature electrode silver paste is in urgent need of localization one of the key raw materials. [0004] At present, the commonly used lead-free surface electrode paste for chip resistors is mainly lead-free electrode paste. The components of lead-free electrode paste mainly include silver powder, organic carrier and g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16H01C7/00
Inventor 何健华陈俏明吴海斌宋永生唐浩张彩云叶向红
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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